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LT4320 based active rectifier

Thank you guys for adding in your requirements. Good news is boardhouse is up and running from today.
Already placed the orders for the LT4320 CRC PSU.
Just about reviewing final designs for SMD and THT rectifiers before shooting the gerbers.
Here are some pics for LT4320 SMD. Everything looks good :)
shown here with MSOP package , DIP can instead be used.
Also shown are the headers spaced 5.08 mm apart.
The other header holes are compatible with SIP-4 rectifiers (PB3510). Also PCB size corresponds to Vishay PB3510 rectifier.
https://www.mouser.in/datasheet/2/427/pb3506-1767492.pdf
regards
prasi
 

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Here is for THT. Everything looks good ;).
Off to boardhouse...

size 55 x 32.5 mm, about same as earlier. Bloody led can be made to bleed the caps with the 3 Watter. if not , options given for resistor pitch.
 

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Hello all,
thanks for adding in your requirements. Its looking to become another big GB.

I am thinking to make the THT in 2.4mm thickness and SMD (as was discussed earlier) in 1.6 mm thickness. Both will be ENIG, 70um copper.

CRC PSU will be same as earlier 2.4mm, 70 um, HASL.

regards
Prasi

P.S. To, member "tantalum nitride" I dont see any requirements mentioned against your name.
 
I am working on a new design of the LT4320 with following changes
1. removal of snubbers
2. size optimization for smaller footprint (SMD could be same as Vishay PB3510 SIP rectifiers in terms of width)
3. MSOP LT4320 chip option along with earlier DIP option
4. LED indication for THT also (is it really necessary?)
5. 2.4 mm thick, 70 um copper with ENIG finish

I will post here when design is done and see the interest for such PCBs.

Regarding ENIG finish, respected member EUVL/Patrick had this to say on another thread:
UDNeSS, or You don't need Semisouth's
 
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Joined 2014
Paid Member
Regarding ENIG finish, respected member EUVL/Patrick had this to say on another thread:
UDNeSS, or You don't need Semisouth's

The ENIG finish is flat and smooth, making alignment and soldering of SMD components a bit easier and less chance of solder bridges between the tiny device legs versus using a HASL finish.
 
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