Hi Daniel,
Thanks for your input. I'll certainly watch your videos.
As for the single transformer/dual mono choice, is there any specific reason to go dual mono? I would happily avoid having to find room for two transformers, if this does not hamper performances.
Thanks for your input. I'll certainly watch your videos.
As for the single transformer/dual mono choice, is there any specific reason to go dual mono? I would happily avoid having to find room for two transformers, if this does not hamper performances.
Hi Andreax,
It is somewhat more complicated to use dual mono in a single chassis, and you can use a single transformer with four secondary windings, or a single transformer with two output windings for simplicity.
Realistically as long as you have a large enough power supply based on the build guide recommendation the choice is yours.
Dual mono or monoblock construction may provide better channel separation in some circumstances, although I am yet to measure that myself.
Also you may have some more flexibility with power supply capacity and layout.
- Daniel
It is somewhat more complicated to use dual mono in a single chassis, and you can use a single transformer with four secondary windings, or a single transformer with two output windings for simplicity.
Realistically as long as you have a large enough power supply based on the build guide recommendation the choice is yours.
Dual mono or monoblock construction may provide better channel separation in some circumstances, although I am yet to measure that myself.
Also you may have some more flexibility with power supply capacity and layout.
- Daniel
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I've always looked at the 5U 400mm from Modushop for a stereo amplifier...
But a true dualmono setup with two of their 4U 400mm monoblok-chassic's would be very convenient. Can 4U heatsinks handle the heat from ±70VDC rails?
But a true dualmono setup with two of their 4U 400mm monoblok-chassic's would be very convenient. Can 4U heatsinks handle the heat from ±70VDC rails?
I did a little simulation of heat dissipation across U3 400mm heatsinks. You can find the simulator here: https://heatscapecal.com/natural
Bob Cordell in his book suggests that, for a class AB amp, heatsinks should be dimensioned so that their temperature is around 60°C for a dissipated power equal to 46% of the maximum output power.
For 71V rails, you find below the temperature distribution in °C across the 400x120x8mm heatsink, assuming four centered heat sources of 27.5W each, 25°C ambient temperature, 0.4 °C/W theta junction-to-case thermal resistance, 1 °C/W theta board-to-case thermal resistance, and a two-layer PCB:
All in all, it seems acceptable to me.
Bob Cordell in his book suggests that, for a class AB amp, heatsinks should be dimensioned so that their temperature is around 60°C for a dissipated power equal to 46% of the maximum output power.
For 71V rails, you find below the temperature distribution in °C across the 400x120x8mm heatsink, assuming four centered heat sources of 27.5W each, 25°C ambient temperature, 0.4 °C/W theta junction-to-case thermal resistance, 1 °C/W theta board-to-case thermal resistance, and a two-layer PCB:
All in all, it seems acceptable to me.
Actually, the above temperature distribution is not representative of the actual one, since the outputs are not centered but mounted closer to the upper edge of the heatsink. This worsens the scenario:
I think this is above my comfort zone.
I think this is above my comfort zone.
400mm length and 120mm height is accurate enough, but how'd you come up with 8mm out of curiosity?
I believe the sinks are 40mm "thick." Not sure how this would translate into how the tool expects the inputs -- just wondering.
This is a cool tool. 😎 (sorry for the pun.)
I came across an argument that placing on the upper third of the heatsink is advantageous compared to the lower third due to convection.
A chimney-effect is created and helps "pull" cooler air across the fins due to the temperature differential.
Conversely, having the heat source on the bottom prevents this convection exchange from occurring as efficiently.
IIRC, someone did some testing on this years ago on DIYA and it seemed to hold.
I've not tested it myself, but it does seem to make sense logically.
A chimney-effect is created and helps "pull" cooler air across the fins due to the temperature differential.
Conversely, having the heat source on the bottom prevents this convection exchange from occurring as efficiently.
IIRC, someone did some testing on this years ago on DIYA and it seemed to hold.
I've not tested it myself, but it does seem to make sense logically.
I'm in the final planning stages for my Wolverine and have just ordered nearly all the parts. Unfortunately the MJL4302 is not in stock currently 🙁
I am not too confident in regards to proper grounding. Does anyone have a wiring diagram or anything? I'm going to order a Cobra-S2 as i have never used a SMPS in a build before and think it would be nice to try something new. The T-GND and GND-lift boards look pretty nice, but am not entirely sure how to best wire everything up to achieve the best possible results. I have attached a quick mock-up grounding scheme.
I am not too confident in regards to proper grounding. Does anyone have a wiring diagram or anything? I'm going to order a Cobra-S2 as i have never used a SMPS in a build before and think it would be nice to try something new. The T-GND and GND-lift boards look pretty nice, but am not entirely sure how to best wire everything up to achieve the best possible results. I have attached a quick mock-up grounding scheme.
Today I realised that wolverine board will not fit paralel in 3u case without some modifications on heatsink bracket. Grrr.
But on the other side in case of 90° is only 1cm more space used because of the ips board and heatsinks on board. What others did in dissipante 3u case?
But on the other side in case of 90° is only 1cm more space used because of the ips board and heatsinks on board. What others did in dissipante 3u case?
You can fit EF3-3 in an extended 3U case. Mine is 42cm deep and heatsinks form sides, boards are perpendicular to heatsinks.
Hi guys, I see that apparently the only difference between 2SC5200-N and 2SC5200-O is h_fe min: 55 for the former and 80 for the latter (whereas h_fe max is the same). Can the two be used interchangeably or has h_fe min a specific role?