Ok, I believe I am going to go with the Heat Sinks I posted earlier (
http://disti-assets.s3.amazonaws.com/straightroadelectronics/files/datasheets/23768.pdf).
I believe that if I build the case in a way that it is physically touching as much of the heatsink as possible, I can use the entire case (hopefully aluminum) to act as 'secondary' heat sink.
In aim to accomplish that, I was thinking something like this:
Given the size and shape of the heat-sinks, there is no way to attach the PCB to them, I am going to have to mount the MOSFETs to the heat sink and then with cables to the PCB.
For that, I have envisioned three options:
- Top: PCBs installed at the back and to the bottom of the case. This allows for the shortest cables from inputs to outputs, as well as the cables to the MOSFETs going 'forward' into the heatsinks. Only long cables in this scenario would be the LEDs. The only problem I foresee here is that the PCBs and the electric intake could be too close. Is this an issue?
- Bottom left: PCBs installed also at the bottom but this time up front. This has the advantage of taking the PCBs as far as possible from the electric input, but it makes for long(ish) cables between in -> PCB -> out (they would be 20cm long each)
- Bottom Right: Same scenario but with PCBs mounted on the sides. I'm not sure if there is an advantage of mounting the PCBs vertically. Are they? This means that the case needs to be quite loner (albeit it can be a bit narrower). Not sure this is the right way to do this. Also this scenario could be done with the PCBs to the back if someone thinks that is useful.
So, the finished project could look something like this:
(This is a 3D rendering, probably my mechanical skills are far less precise and fine, but here's to hoping
)
What do you guys think? Any insight as to which would be the best approach? Thanks!
Best regards,
Rafa.