While they last...

Maybe I'm worrying too mutch.

The big gap if I screw up two Tokins together, is about 0.5 mm at the screwholes. If I measure gap perpendicular to the SITs longer side, it is decreases in a short way below 0.05 mm.
It is quite interesting at the same time, if I try to measure at the shorter side, I almost able to put through 0.05mm gap meter.
So this side is concave a littlebit.
I think, Soundhappy is right, when he recommend Kerafoil.
Mica too hard in this case, while Kerafoil 0.25 will be able to fill the gap.

Yet, it would be nice, if we know the recommended torque settings.

This is what I was trying to talk about:
 

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Thanks Gyuri 🙂

I keep original anodized metal protection layer.
Make up imperfections with small thermal paste goop layer is easy,
thermal film thickness can compensate as well.
Naked copper does easily oxidize and become grey green after a longer period of time.
Oxidation I am worry about.
 
Good point, Soundhappy!
And there is an eternal question:
If we would like to make a plain and smooth surface, how smooth is we need?
If it will be like a glass surface, there will no remain goop between device and heatsink.
About oxidation, you are correct, I doesn't gave a tought to this viewpoint.
I hope so, on the fixed device with mica and goop it will be not an issue.