do you guys realize that TPA3255 has only been available for a few days...
I thought it was out???
https://e2e.ti.com/support/amplifiers/audio_amplifiers/f/6/t/515393
D
Deleted member 148505
I wonder why nobody has started to sell the TPA3251 or the TPA3255 yet? I am talking about companies like yuan-jing.com. I think Sinewave has the TPA3251 but I kinda want the TPA3255
Maybe they are waiting for "binned" ICs. Or maybe the ICs are not really available in their region. (or maybe they are still manufacturing their own
)if "out" means "general availibitlity", nope.
Of course there are some pre-production samples around. This thread even has a picture
TPA3255 datasheet revision history (page 2) :
update date :
As of today, TPA3255DDV sample request or purchase order can be placed on TI website, but no shipment date yet.
Mass production not yet reached the shelf.
Good find. The original link no longer works, here's a related app note: http://www.ti.com/lit/an/slaa702/slaa702.pdf
It has the following blurb:
Any ideas how the op-amp front end can be addressed?
@doctormord Question answered!
Btw. I've been following your TPA3255 posts, will you be releasing it as a populated board and any rough timeframes?
Guys, after a year of hibernation I am completing my TPA3251D2 design for a 2+1 FAST system for desktop listening. I've been studying SLAA719 (analog grounding for TPA32xx) and ensuring I keep the analog grounds for the preamp section (I have a high/low pass filter + Linkwitz transform) well separate from the power section joined at a star point for the main power line filter capacitor.
In the app note I see mention of separation of digital and analog grounds on the TPA chip itself (pins 12/13 being analog ground) with no mention of this in the datasheet and the evaluation board also has these pins connected to the GND track underneath the IC so being shared with the power pins & these pins would 'see' the switching power currents from the output stage. This creates extra noise especially for single ended analog stages before the TPA IC, which is what I'm doing.
The app note has some nice graphs showing the improvement in the noise with star grounding when both the preamp and TPA analog ground are star connected but it doesn't show the impact of the TPA IC analog ground sharing common ground path with the power output stage when the preamp opamps use a star ground. Reason why I ask is that having almost finished routing the PCB it is going to be a pain to try to separate the ground traces for pins 11/12.
I'm thinking of just ignoring it an using star ground for just the preamp stage. Any thoughts or even results of your experiments with grounding to share? Thanks.
I'll post the PCB when completed.
In the app note I see mention of separation of digital and analog grounds on the TPA chip itself (pins 12/13 being analog ground) with no mention of this in the datasheet and the evaluation board also has these pins connected to the GND track underneath the IC so being shared with the power pins & these pins would 'see' the switching power currents from the output stage. This creates extra noise especially for single ended analog stages before the TPA IC, which is what I'm doing.
The app note has some nice graphs showing the improvement in the noise with star grounding when both the preamp and TPA analog ground are star connected but it doesn't show the impact of the TPA IC analog ground sharing common ground path with the power output stage when the preamp opamps use a star ground. Reason why I ask is that having almost finished routing the PCB it is going to be a pain to try to separate the ground traces for pins 11/12.
I'm thinking of just ignoring it an using star ground for just the preamp stage. Any thoughts or even results of your experiments with grounding to share? Thanks.
I'll post the PCB when completed.
I plan to do a groupbuy for populated boards - but first i'll need to get a quote from my local stuffing subcontractor. I wont solder several at home.
Any news on price?
Just for clarity.
TPA3116 two differential amplifiers. If only one side of the differential input is driven then both outputs will produce signals 180deg apart.
TPA3251 four independent amplifiers. Both sides of BTL have to be driven 180deg apart to get output signals 180deg apart.
Attachments
There's a evaluation board based on the design
High Fidelity 175W Class-D Audio Amplifier with Digital Inputs and Processing Reference Design - TIDA-00874 - TI Tool Folder
High Fidelity 175W Class-D Audio Amplifier with Digital Inputs and Processing Reference Design - TIDA-00874 - TI Tool Folder
Sorry, there is apparently EVMs available for purchase..
TPA3251D2EVM TEXAS INSTRUMENTS, EVAL BOARD, TPA3251 AMPLIFIER | Farnell element14
//
TPA3251D2EVM TEXAS INSTRUMENTS, EVAL BOARD, TPA3251 AMPLIFIER | Farnell element14
//
That price seems kind of high? But I'm really new to these things.
And a car amp:
700W Automotive Class D Audio Amplifier Reference Design - PMP11769 - TI Tool Folder
And a car amp:
700W Automotive Class D Audio Amplifier Reference Design - PMP11769 - TI Tool Folder
Sorry - but that can't be the whole story regarding the high prices. The TPA3255 EVM is 259 €
You can get european made class d amplifiers, for less that amount, and with proprietary solutions. You can get two Audiopower MDA400S for that price, and this includes PSU, and the Hypex UcD 180 standard is also cheaper than a TPA3255 EVM module.
I don't think TI will support the DIY community, and then there is a little extra charge for that. Also, if you are a developer with and TI account, you can often get samples for free or cheaper.
You can get european made class d amplifiers, for less that amount, and with proprietary solutions. You can get two Audiopower MDA400S for that price, and this includes PSU, and the Hypex UcD 180 standard is also cheaper than a TPA3255 EVM module.
I don't think TI will support the DIY community, and then there is a little extra charge for that. Also, if you are a developer with and TI account, you can often get samples for free or cheaper.
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