Another way to use a gap filler pad and attach the heatsink to the component side
Something like this Thermal Interface Sheet, 2.2W/m*K, 150 x 150mm 1.2mm, Self-Adhesive | RS Components
It's not easy to add fixing holes to the existing board and I don't know if making the board bigger would work in various amplifiers.
The original module and my clone has no short circuit protection. Shorting a speaker cable is likely to blow it and the outputs.
I have done my best with pad cooling, but my clone would benefit from an alumina PCB for better heat transfer
It would, but my goal was to make a drop in clone of the originalHowever - - the chinese STK's sometimes works - - or??
Is it a question of sufficient cooling?
What if I mount a Peltier element on the backside, add a heatsink and a separate power supply for this element and apply enough power to cool the cold side below - say 20 deg C, - would that work?
SO - with a nod from davidrsb (as I understood it) I turned to some family relation, who does small electronic production as described on page 3.
Will it be possible to produce a small number of STK3102 based om Davids documentation?
Yes it will.