If you look at crimp connectors on mouser, you can filter by the min and max wire size.Seems like all the crimp pins I get are not sized properly for the wire, the little ears that wrap the wire and insulated part of the wire are to small (22 guage wire) but I never see any kind of selection.
Bill
Not to hijack this thread, but a question about terminal crimping vs. soldering directly.
I own several crimping tools including MILSPEC for Packard type connectors for my HMMWV and gensets.
My question is, if so many components on the SUT or Phono stage amp, Preamp, Amp and speaker crossover are SOLDERED, what is the advantage (electro-mechanically) of using standard (or silver/gold plated if you can find them) blade-type push-on connectors instead of a good solder joint?
I know, I know, it’s like one of those “Glock or 1911,” “Chevy or Ford” or even “IPA or Pilsner” questions, but I’m serious here.
Thanks in advance.
NB
I own several crimping tools including MILSPEC for Packard type connectors for my HMMWV and gensets.
My question is, if so many components on the SUT or Phono stage amp, Preamp, Amp and speaker crossover are SOLDERED, what is the advantage (electro-mechanically) of using standard (or silver/gold plated if you can find them) blade-type push-on connectors instead of a good solder joint?
I know, I know, it’s like one of those “Glock or 1911,” “Chevy or Ford” or even “IPA or Pilsner” questions, but I’m serious here.
Thanks in advance.
NB
^
The only advantages are related to convenience.
There isn't an electromechanical advantage.what is the advantage (electro-mechanically) of using standard (or silver/gold plated if you can find them) blade-type push-on connectors instead of a good solder joint?
The only advantages are related to convenience.
Perhaps better strain relief and less susceptibility to vibration with a good crimp compared to soldering direct? At least for the wire.
^ Great call. I read into / assumed in the above question that proper strain relief / wire dressing was a given. I shouldn't assume. 
