LuDEF

Living on the edge!

Sounds like Zen Mod's idea of a makeshift lever to apply pressure could be enough.

read datasheet of LU

its sturdy little bugger

as used in LuDEF, 2V4 @1A5, it'll live zillion years, with no sweat

with 1.8C/W , as junction to case figure, I'm sleeping well

just take in account that, say, IRF510 and similar, are often used at 1W, without heatsink** ......... and when there is heatsink, it's usually small piece of Al plate in air, not big chunk of Al as here, being fast to draw from little bugger

**not that I'm doing that, ZM Chicken

so, nice clamp, piece of Keratherm under, no biggie

tricks are necessary for lhquam's future adventures, not LuDEF
 
Updated Gerber files for TO-247 adapter with no thermal reliefs. Not that the bolt pattern should allow clamping with UMS heatsinks. The aluminum IMS PCB provides thermal transfer, extended legs for underhung PCB mount, and easy mounting as TO-247 or as clamp with lateral bolt holes on UMS heatsink.

attachment.php
 

Attachments

I held the tab to the sink with a large flat washer (at an angle) and
counted on the silicone and anodizing to withstand the couple volts...

:Pirate:


Arrrrrr...

The LU1014D in the F3 is operated common-source and thus the drain voltage of the JFET is only about 3.5V, which should not present an aluminum oxide dielectric breakdown problem.
But, with the LU1014D operating as a source-follower, the drain-to-heatsink voltage can approach the rail voltage, which could be a problem with the anodized (aluminum oxide) insulator.
 
I held the tab to the sink with a large flat washer (at an angle) and
counted on the silicone and anodizing to withstand the couple volts...


A premium thermal grease has a thermal conductivity of 8.5W/mK.
Optimal grease thickness is 0.1mm.
For 3.6W dissipation, and the LU1014 footprint of 6x7mm, temperature difference across a single layer of grease is 1.01°C.
Total temperature difference from heatsink to LU1014 substrate is 7.53°C.

Assume a copper spreader of 20x7mm with 2x 2.7mm mounting holes for M2.5 screws.
https://www.diyaudio.com/forums/att...ch-lu1014-power-jfet-buy-lu1014d-heatsink-jpg
Assume insulation by Kerafol 86/82.
Further assume 0.2mm SnAg solder between LU1014 and spreader.
Lovoltech LU1014 Power Jfet Group Buy
Temperature drop across the Kerafol is 0.98°C, that across the solder joint is 0.22°C.
Total temperature difference from heatsink to Lu1014 case is 1.2°C.
Total dT heatsink to substrate is 7.72°C.

I guess 0.2°C more for electrical insulation up to 1kV is not a bad deal. 😉


Cheers,
Patrick