Hi,
Does anyone have any more info on XMOS issues with ESD, I have two DACs with older XMOS chips (ifi & minidsp) that aren't working. I assume the ESD death symptom is that the device just isn't detected?
I was searching through threads and I can see many references to ESD issues with XMOS boards, statements like:
"these are very fragile devices"
"I have broken 2 ... with seemingly no cause"
"take precautions for static... not taking a single chance"
"I will add ESD diodes to the USB port"
"never hot-plug them"
And a link to an advisory: https://www.xmos.ai/download/Design...onnections-for-xCORE-200-USB-devices(2.0).pdf
Thanks.
Does anyone have any more info on XMOS issues with ESD, I have two DACs with older XMOS chips (ifi & minidsp) that aren't working. I assume the ESD death symptom is that the device just isn't detected?
I was searching through threads and I can see many references to ESD issues with XMOS boards, statements like:
"these are very fragile devices"
"I have broken 2 ... with seemingly no cause"
"take precautions for static... not taking a single chance"
"I will add ESD diodes to the USB port"
"never hot-plug them"
And a link to an advisory: https://www.xmos.ai/download/Design...onnections-for-xCORE-200-USB-devices(2.0).pdf
Thanks.
There is similar on page 19 of the document at: https://www.xmos.com/download/XU208-128-QF48-Datasheet(1.16).pdf ...or search it for the term "esd protection"
This pic is from: https://www.xmos.com/download/XS1-U8A-64-FB96-Datasheet(X6319D).pdf
This pic is from: https://www.xmos.com/download/XS1-U8A-64-FB96-Datasheet(X6319D).pdf
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And.....16.3 Moisture SensitivityXMOS devices are, like all semiconductor devices, susceptible to moisture absorption. When removed from the sealed packaging, the devices slowly absorb moisturefrom the surrounding environment. If the level of moisture present in the deviceis too high during reflow, damage can occur due to the increased internal vapourpressure of moisture. Example damage can include bond wire damage, die lifting,internal or external package cracks and/or delamination.All XMOS devices are Moisture Sensitivity Level (MSL) 3 - devices have a shelf lifeof 168 hours between removal from the packaging and reflow, provided theyare stored below 30C and 60% RH. If devices have exceeded these values or anincluded moisture indicator card shows excessive levels of moisture, then the partsshould be baked as appropriate before use. This is based on information from JointIPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For Nonhermetic... 🙄 🙄 🙄