Pico, this might be a silly question, but looking at the proximity of the bottom of the IEC mains connector cutout to the bottom of the base plate, which looks to be around 13.6mm scaling it off your back panel drawing - then when one mounts the inner baseplate inside the chassis, which effectively raises the internal floor height, will the bottom of the IEC connector clear the inner baseplate. I don't know how much height you lose when adding the inner baseplate - maybe Gianluca can answer that?
To give adequate clearance, do you think it might be wise to move the IEC inlet cutout up a bit and also maybe the speaker binding post holes as well. Just a thought.
To give adequate clearance, do you think it might be wise to move the IEC inlet cutout up a bit and also maybe the speaker binding post holes as well. Just a thought.
The bottom of the IEC cutout to the bottom edge of the back panel is 14.5mm
Let me check the cutout on the 5u x 400mm modushop chassis I have laying around.
Let me check the cutout on the 5u x 400mm modushop chassis I have laying around.
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The steel plate sits around 9.5mm above the bottom panel (ie on the one I have), so that would be a little greater than 5.0mm of clearance for an FKID IEC from the installed Steel Bottom Plate.
A non-filtered IEC would have more clearance again.
I could add an additional 10mm of clearance if that would make people feel less anxious
You better say now or forever hold your peace. Hahahaha
A non-filtered IEC would have more clearance again.
I could add an additional 10mm of clearance if that would make people feel less anxious
You better say now or forever hold your peace. Hahahaha
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Binding posts have plenty of clearance.
An FKID IEC would have a little greater than 5mm of clearance from the steel base plate.
If 5mm clearance makes people nervous I could raise it another 10mm.
Based on your measurements then pico, I would be happy if you raised the IEC cutout and the speaker binding post holes by 10mm, for adequate clearance from these items to the inner base plate- what do other members think?
Certainly the IEC connector.
How far would that put the binding posts above the inner baseplate?
Certainly the IEC connector.
How far would that put the binding posts above the inner baseplate?
BA-3 input stage on backplate
By raising the IEC connector will there be at least 70 better 80 mm left between Top and IEC for mounting of a BA-3 input stage on backplate?
By raising the IEC connector will there be at least 70 better 80 mm left between Top and IEC for mounting of a BA-3 input stage on backplate?
Without moving it, there is 89.5 mm clearance to the top edge
What if we raise it by 5 mm?
5 - max. 10 mm raise is perfectly fine with me then.
Thank you very much. Really looking forward to ordering those babies.
Thank you very much. Really looking forward to ordering those babies.
I am OK with that pico, as long as the bottom edge of the IEC connector comfortably clears the inner baseplate by 5mm or so that will be fine.
Do you know how the inner baseplate bolts to the chassis frame? Is there a fixed position for this?
Do you know how the inner baseplate bolts to the chassis frame? Is there a fixed position for this?
The baseplate is usually mounted on the heatsink rails but since it does not cover the whole surface of the bottom cover it can be moved around a bit
What colour front panel are you guys thinking of?
Starting to get excited, about this.
I normally go with a natural colour front panel, but this time around gonna get anodized black.
What are you guys thinking of getting?
Starting to get excited, about this.
I normally go with a natural colour front panel, but this time around gonna get anodized black.
What are you guys thinking of getting?