TPA3223

I have used 50v type 0603 caps for bootstrap 33nf.
Driving both channel perfectly connected.
Tpa3223 blows up with its power pins burnt and shows all or some pins shorted to negative(ground).
I will source a different supplier and brand. I am currently using yageo brand as this is locally available.
I am not sure if the rated voltage is correct.
But i am pretty sure all the designs are followed as per T.I. guidelines.
Also do u think higher inductance is required or 10uh is good?
Thanks for your suggestion and also for futher guidance.
 
What's the thickness of the 4 decoupling caps (C72-75) you have under the heatsink @sweetperfume ? If you went with the TI EVM those are 1uF/100V and TDK's data for that value shows 1.45 or 1.5mm thickness. That would mean the caps touch the heatsink before the IC does (1.2mm max height) so you'd need a shim or spacer between heatsink and IC for good thermal contact.
 
Also not once where ground pins damaged in any case. Only power or output pins would burn or in some cases 1 to 3 output pins would show short to ground and all other voltages would remain same as if oc was good.
It will be just in fault mode forever. Input voltages and other voltages would be good with no burning just 1 to 3 pins from output would be shorted to ground internally causing startup failure for output fets.
 
Looking carefully at your photo of assembled board with chip removed, I assumed because it blew up. I see that it appears to soldered this with a soldering iron? The joints are not clean and a lot of excess solder. I suspect a lot of your issues might be related to bridging or shorts on the output wires - you need to use solder paste and hot air or hot air/hot plate techniques. The solder joints need to look neat and clean around the pins on TPA32xx chip or it won’t be reliable.

This is closeup of your board:
IMG_1395.jpeg


Here is what the solder joints should look like if done properly. This is my TPA3255 and I hand applied the paste and used a hot plate on bottom to preheat to 125C and hot air pencil from above to locally melt. The joints need to be clean and uniform. Bridging on 0.65mm pitch pin spacing is very common if hand soldered.

1709219441008.jpeg
 
I am powering it with onboard dcdc convertor which can do 300watts continuously. Its been fed correctly. Board was designed correctly. Still after somedays it will die.
First one that i built had its lc filter 30mm away from ic pin, and that board did not do well.
And this was the latest, survived 2 weeks then died while in use.
I checked ocp on high volumes,worked like a charm. But dies for some unknown reasons.