Not a chip, but kinda close. Not class d though, but are you thinking of something like this, or do tou really mean a chip?
A-120 - Amplimo audio power amplifier module 120W - Europe Audio
A-120 - Amplimo audio power amplifier module 120W - Europe Audio
Yes,I have read similar reports through the years.
I think that my friend did have the 60watt modules.
They are not cost effective but very novel indeed.
jer 🙂
I think that my friend did have the 60watt modules.
They are not cost effective but very novel indeed.
jer 🙂
Can we have the capacitors and rectifiers built inside the chip? A virtual grounding circuit will allow a chip to work on a half-wave (single) AC transformer. Remember the catch phrase from the food industry, "Just add water?" We need an audio chip with the slogan, "Just add power."
So you want a power amplifier, along with the power supply's rectifiers and smoothing caps, "inside the chip".
For more than a very small amount of power, that is not a realistic goal, unless you redefine "chip" to actually mean "box with components in it".
While you're at it, why not include the transformer, and the volume control, and the speakers, inside the chip? For a chip that could produce a usable amount of power, that stuff would fit inside the chip just as easily as the smoothing capacitors would.
But at least if you could get the PSU smoothing caps right next to the point of load then separate decoupling caps shouldn't be needed, which would save some space inside the chip.
Maybe you could design us a car, too. I'd want one with a gas station, including the underground storage tanks, inside the car. That way people would never have to figure out how to find a gas station. It's about time someone came out with one of those. And how about a refrigerator that has a grocery store inside? That's another long-overdue idea.
I got yer car right here.Maybe you could design us a car, too. I'd want one with a gas station, including the underground storage tanks, inside the car. That way people would never have to figure out how to find a gas station. It's about time someone came out with one of those. And how about a refrigerator that has a grocery store inside? That's another long-overdue idea.
Ford Nucleon - Wikipedia, the free encyclopedia
Easy fellas i saw a chip last night with psu built in it also contains a dac and a solidstate Hdd... Sounds fantastic..
Shame the alarm clock woke me up.
Shame the alarm clock woke me up.
Somebody (I thought it was PE) was selling some modules, not chips, that only had signal and power leads. I didn't see them in any of the catalogs I had handy and can't remember the maker.
Probably not any amplifier, but IMO anyone can build a DIY amplifier.
"Golden eras"... a punny anagram.😀
Probably not any amplifier, but IMO anyone can build a DIY amplifier.
"Golden eras"... a punny anagram.😀
Might not be far away:
http://www.sematech.org/meetings/archives/symposia/8845/05_Rajiv Maheshwary of Synopsys.pdf
http://emlab.uiuc.edu/tsv/Yokohama_paper.pdf
There are some very small class D drivers for headphones (low power) we looked at one similar to the device here;
http://www.ti.com/lit/an/snaa067/snaa067.pdf
to make a headphone amp module, basicly a pcb that you mount as a component on your board. BGA devices are similar, the chip is fitted to a CPB with forms the base of the BGA.
You can get some very small and neat devices this way.
As multi IC packaging and thermal issues are addressed there will be more modules coming along, with the increase of mobile communication/computers there is a market for low power audio and video subsystems.
http://www.sematech.org/meetings/archives/symposia/8845/05_Rajiv Maheshwary of Synopsys.pdf
http://emlab.uiuc.edu/tsv/Yokohama_paper.pdf
There are some very small class D drivers for headphones (low power) we looked at one similar to the device here;
http://www.ti.com/lit/an/snaa067/snaa067.pdf
to make a headphone amp module, basicly a pcb that you mount as a component on your board. BGA devices are similar, the chip is fitted to a CPB with forms the base of the BGA.
You can get some very small and neat devices this way.
As multi IC packaging and thermal issues are addressed there will be more modules coming along, with the increase of mobile communication/computers there is a market for low power audio and video subsystems.
Anyone built a headphone amp with the IC marche mentioned. They are very small 2mmx2mm with 16 solder balls . Is it possible to use a domestic oven to solder these
There is a downside to including the PSU and any large caps in the power module.
HEAT
Any Power Amp will get hot. Caps dry out if they get hot and fail.
During the days of repairable TVs, a common component to fail was the Start-Up capacitor that was often located very close to the heatsink that the SMPS controller was fitted to.
HEAT
Any Power Amp will get hot. Caps dry out if they get hot and fail.
During the days of repairable TVs, a common component to fail was the Start-Up capacitor that was often located very close to the heatsink that the SMPS controller was fitted to.
You buy such a 'chip', connect a source to the input, a speaker to the output and a power supply to the supply connector. What exactly is the 'building' part of it?It will be so simple that anyone will be able to build their own amp.
These sort of devices allow you to throw an audio output on any portable media device, in fact there development has been led by that markets requirements. Not the final word in hi fidelity, but had some reasonable results driving decent headphones (quite surprising), but for limited bandwith MP3 playback over a phone speaker, perfect, takes up little board space, not a lot of heatgenerated, minimal power wasted (perfecr for battery use) and easily to implement.
I think the next step will be a class D amp packaged like Nationals simple switcher convertors:
http://www.ti.com/lit/ds/symlink/lmz14203.pdf
You can build a mini system with IP Op and PSU using very few devices these days and very little board space.
I think the next step will be a class D amp packaged like Nationals simple switcher convertors:
http://www.ti.com/lit/ds/symlink/lmz14203.pdf
You can build a mini system with IP Op and PSU using very few devices these days and very little board space.
Thanks for your comments. I liked the smart a** funny comments as well. I think it is about time that we have some low-power all-in-one amp chip.
When cars were new 111+ years ago, law makers argued who would buy this expensive, ugly, loud, metallic object with wheels that any horse or donkey can pass with ease. Gootee seems like one of those law makers reincarnated.Maybe you could design us a car, too. I'd want one with a gas station, including the underground storage tanks, inside the car. That way people would never have to figure out how to find a gas station. It's about time someone came out with one of those. And how about a refrigerator that has a grocery store inside? That's another long-overdue idea.
Thanks for your comments. I liked the smart a** funny comments as well. I think it is about time that we have some low-power all-in-one amp chip.
It's only likely to happen as a Thick Film Device, ie a potted hybrid of semiconductor wafer and SMD devices.
This is down to the fact that it is very difficult to build large capacitors out of thin silicon. It's easier to build them out of alluminium and plastic.
Even the ILP Hybrid amps that I suggested in the early part of this thread are Hybrids.
The lowest powered amps of all - Hearing Aids - are still, to my knowledge, Thick Film construction.
I don't know if I would want things to get any smaller from a DIY point of view.
I still like how capacitors were treated as a component and proudly stood atop of classic tube amps.
I still like how capacitors were treated as a component and proudly stood atop of classic tube amps.
Its easy to make silicon transistors.
Resistors are just thin tracks or lumps of silicon.
Inductors are just coils of silicon or copper traces.
Capacitors though need larges areas of conductive film. It's just not economical to make large caps on a semiconductor die.
Resistors are just thin tracks or lumps of silicon.
Inductors are just coils of silicon or copper traces.
Capacitors though need larges areas of conductive film. It's just not economical to make large caps on a semiconductor die.
I don't understand why you need to bring personal comments into a technical Forum.Gootee seems like
I am reporting your post.
Yes they will be hybrids, lots of devices are these days, even BGA devices such as FPGA's. PAckaging is also smarter these days so a lot dont look like the hybrids of old, with a big black lump of goo on them, also multi chip modules are starting to aspear. So before long you might find a multichip module with DSP,FPGA, DAC etc on 1 BGA device and a module for outputs.
An example of how some of the new hybrids look, you just treat them as a single SMD device.
QPI-9LZ
An example of how some of the new hybrids look, you just treat them as a single SMD device.
QPI-9LZ
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