I heard all of those,
1612 a little thin sound in I/V
LM4562, the same. Are the HA package a little different ?
The nicer of this list is IME, the op1652 in I/V task.
1612 of course is attractive for ome modern low noise SD DAC chip,
1612 a little thin sound in I/V
LM4562, the same. Are the HA package a little different ?
The nicer of this list is IME, the op1652 in I/V task.
1612 of course is attractive for ome modern low noise SD DAC chip,
It's the same die inside. The TO-99 package will have the lowest package stress, which impacts things like input offset. I can make a theoretical argument for why the TO-99 (or HA in the National Semiconductor numerology) would be better, but like I sad, I've never been able to measure any difference.LM4562, the same. Are the HA package a little different ?
Tom
Single is better. Better decoupling, less heat, no interferences etc.Is there any real advantage to using single opamp in the DAC output stage?
Most of the equipment i see uses dual opamp in the output stage, would this be just to save cost and board size?
(But require slight more space. And slight cost increase. Multi op is for saving the space...)
Try to take a look at the models. I think that not "real" elements models but macromodules for different HFs. It is OK but not maybe not showing the real results for this aplication?That jump in the 1656 inp. impedance curve .. how can that happen? An error in the spice model..🤔..
Or.. open loop output impedance excursions maybe?
Probably the best method is to make a circuits, measure and listen?
Based on initial spice results.
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