Hello everyone,
I'm looking to add some bypass/decoupling capacitor on a microcontroller unit but I was thinking which rail would be the best to bypass/decouple.
I've got some options like VDD-VDDA-VSSA etc etc, i'm not an expert in this just an hobbyist.
Thanks!
I'm looking to add some bypass/decoupling capacitor on a microcontroller unit but I was thinking which rail would be the best to bypass/decouple.
I've got some options like VDD-VDDA-VSSA etc etc, i'm not an expert in this just an hobbyist.
Thanks!
All of them? What are the most important to do?
VDD, VSS_DCDC ~ VDDA, VSSA?
One last question, if the microcontroller's cpu works up to 150mhz would be better to use 0.01uf decoupling or 0.1uf?
VDD, VSS_DCDC ~ VDDA, VSSA?
One last question, if the microcontroller's cpu works up to 150mhz would be better to use 0.01uf decoupling or 0.1uf?
Your first post is not clear to me: what do you mean by 'microcontroller unit '?
Is this a ready made board with microcontroller such as an Arduino or similar?
Or are you building your own board with a microcontroller ic?
If the first then it should be sufficient to decouple the main supply.
If the latter then you need the datasheet.
Is this a ready made board with microcontroller such as an Arduino or similar?
Or are you building your own board with a microcontroller ic?
If the first then it should be sufficient to decouple the main supply.
If the latter then you need the datasheet.
this but the datasheet isn't pubic, so i should decouple the vdda/vssa ~ vdd/?Is this a ready made board with microcontroller such as an Arduino or similar?
this is the mcu internal schematic pins, any suggestion?
What about the decoupling capacitor size?
Thanks
Attachments
That schematic shows all the requisite decoupling already - if this is the module you have its all done for you.
Normally you'd assume as a bare minimum for any logic chip to have 100nF ceramic cap on every single supply
pin to ground within mm of the chip.
Normally you'd assume as a bare minimum for any logic chip to have 100nF ceramic cap on every single supply
pin to ground within mm of the chip.