Sorry about the misunderstanding.
The process with the negative film is also very simple, the beauty is that you can re-apply the film if you make a mistake.
1. Take the photo negative film and cut it to size.
2. Clean the copper clad board with fine abrasive paper and wipe clean with mentholated spirit.
3. Peel the thicker film off the photo negative film and apply the film to the copper board carefully removing any bubbles of air.
The film can be lifted and reapplied without any problems at this stage.
4. Pass the board through a laminator or iron it with a moderate iron to set the emulsion onto the copper.
5. Expose the board with a photo negative with a UV light source.
6. Remove the upper film from the photo resist.
6A. Develop the board in proprietory developer (Baking Soda)
7. Now you can etch it in the normal manner with Ferric Chloride (or the etchant of your choosing).
8. The film peels off easily after soaking in a caustic soda solution.
