Very basic chip amp question

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Let's say I wanna build an IGC sub amp...since I have control of amp construction and sub construction:

what is the difference, quality and/or level, if I build:

(1) a 2 chip parallel IGC, which I would then then drive the sub's 2 voice coils in parallel for a nominal 4R load.

(2) a 2 chip bridged IGC, which I would then drive the sub's 2 voice coild in series for a nominal 16R load.

TIA
 
The easiest solution would be to build two identical gainclones driving one voice coil each. This would avoid the additional circuitry needed for parallel operation (servos, load-share resistors etc). Also, there's no power benefit to paralleling two GCs into 4R over two seperate GCs driving 8R each.

Come to think of it, there's also no benefit bridging two GCs into 16R - the power will be the same as two seperate GCs driving 8R each.

Nice one,
David.
 
Yup, I agree, two normal GCs, one per VC.

Or, you could just drive one coil with your bridged/paralled GC, and use the other with a 250Ohm wirewound pot wired across it, that way, you can tweak your Q for room response. 😉
 
DC offset on the input?

How much DC offset on the input will the LM3875/3886 chips accept? A few volts? Just wondering if a cathode follower valve driving the power op amp *must* be DC isolated.

I couldn't find it from the datasheet.
 
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