Not to sound like a tool but i did toy with that idea before then was turned off when in one video the thing would fume like mad whenever a board was dunk. Its not doing that here, and looks like a winning solution. Any idea whats in their spray bottle?
Maybe you are a factor into that 😉
You bet.
And that is a problem.
You overheat areas and parts which shouldn´t.
Not sure why you consider that an advantage.
Not necessarily.
Applying paste pad by pad has less precision and takes more, go figure.
To boot, result is unreliable.
Not necessarily.
You do it both ways and show us time involved. (YT video).
[]quote]Will it translate to thruhole assembly? I will let you know soon[/quote]
HOW do you intend to apply paste to each pad?
* stencil?
* one by one using a syringe/toothpick?
Please show that in the video.
One of the former forum members said that they used a hot-plate for proto-types. Unfortunately for "through-hole" you will need a dandy set of flush wire clippers.
If I don't have a stencil when doing SMT, I use a straight pin to dab the solder paste. Advice to the wise -- get the stencil.
If I don't have a stencil when doing SMT, I use a straight pin to dab the solder paste. Advice to the wise -- get the stencil.
Hotplate was me. My point, which I didn’t make clear, was you can’t use the hotplate method with TH components, which makes using the hot air pencil a much longer process to get the board hot enough for the paste to flow.
Bottom line, IMO, Hot air and TH components will not be faster than spool solder and iron. 😉
Bottom line, IMO, Hot air and TH components will not be faster than spool solder and iron. 😉