The MeanWell UHP-500R-48 power supply is passively cooled through coupling with the chassis it is mounted in.
I could use thermal paste, but it can be messy and hard to apply in a thin even layer over a large surface, I am leaning towards using a large thermal pad.
The thermal pad should be ~232mm x 81mm for the power supply,
And I am going to need one for the amplifier board heat sink to couple it to the chassis heat sink, 3e Audio TPA3255 TPA3251 480-1-29A, 120mm x 85mm,
Suggestions on what brand and series thermal pad would be a good choice?
Thank you, David.
I could use thermal paste, but it can be messy and hard to apply in a thin even layer over a large surface, I am leaning towards using a large thermal pad.
The thermal pad should be ~232mm x 81mm for the power supply,
And I am going to need one for the amplifier board heat sink to couple it to the chassis heat sink, 3e Audio TPA3255 TPA3251 480-1-29A, 120mm x 85mm,
Suggestions on what brand and series thermal pad would be a good choice?
Thank you, David.
How about something like this. Use multiple to cover the area.
https://www.aileronlabs.com/products/keratherm-86-82-insulation
https://www.aileronlabs.com/products/keratherm-86-82-insulation
Did you do a quick thermal assessment of that module? The devise report identifies individual part temp rise above two ambient temps. Did you identify which parts are internally bolted/heatsunk to the modules frame, and where on the frame? It looks like the max thermal dissipation is circa 48x10x0.05=25W, and a reasonable percentage of that has to convect though the top. With such a large psuedo-contact surface area, even without any thermal interface modification, you may find a negligible change when adding a full area interface. Have you characterised your local temperature operating conditions and how heat then flows to a room ambient?