Pretty sure ive seen this done elsewhere but heres the method of output transistor mounting im looking at for my headphone amp.
The to126 transistors (bd139/140) are bent horizontally and faces up. The heatsink is coupled to the exposed ground plane by the mounting screw.
I see benefit in this from better heat dissipation and less leg inductance (the transistor legs would be cut as short as possible)
But what about increased parasitic capacitance? The transistor is now sandwiched between two conductive elements. Is this a good thing? And should the layers & heatsink be connected to power traces instead of ground? Thanks in advance
The to126 transistors (bd139/140) are bent horizontally and faces up. The heatsink is coupled to the exposed ground plane by the mounting screw.
I see benefit in this from better heat dissipation and less leg inductance (the transistor legs would be cut as short as possible)
But what about increased parasitic capacitance? The transistor is now sandwiched between two conductive elements. Is this a good thing? And should the layers & heatsink be connected to power traces instead of ground? Thanks in advance
