Heat compound.

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A brush can create a lot of furrows with excess compound.

What I do is use a single edge razor blade rather like a squeegee to create a very thin, consistent coat.

Remember, the only useful purpose of the compound is to fill the very small voids between the device and the heatsink, not to create a layer of compound between the device and the heatsink.

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All you really want to do is fill in the tiny pores/blemishes in the heatsink and on the chip and then you want a small film so the heatsink can make sufficient contact with the chip. It's almost impossible to get a chip completely flat against your heatsink, so your compound will also give you a little big of leeway.

Seriously, very little. I used to be in the computer hardware scene, and even a tad too much can make your temperatures skyrocket. So keep it thin.
 
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