Just to give people an insight as to how it is done in industrial power supplies.
A piece of equipment I worked on last week 450VDC to 3 phase AC inverter, 100A per phase dI/dt 100A/us worst case.
Supply from the batteries was cable to a circuit breaker then a small air core filter choke. The choke fed a bank of decoupling capacitors (60000uF) these were connected by a sheet sandwich bus, top sheet positive bottom sheet negative with a 0.5mm mylar sheet separator. The sandwich bus which was 350mm wide fed the IGBTs directly, there were some box type decoupling capacitors directly connected between the rails at the IGBT end of the bus. This is how a load is fed where low inductance is a design goal. There were no film capacitors connected across the decoupling electrolytics. If the filter capacitors are not mounted on the same board as the load the stray inductance in the leads feeding the load may be more than the combined ESL of the filter electrolytics.
To put audio loads in perspective an amplifier producing 2000W of 20Khz sine wave into an 8 ohm load has a dI/dt of 1.9A/us so we are not exactly talking about demanding loads which require extreme bypassing measures.
As a counterpoint a 160Kw Inverter in my garage has the 3 phase rectifier coupled to the IGBT bridge with some copper straps and a fuse, filter capacitors are 12000uF and there are no film capacitors or sandwich bus used anywhere dI/dt is determined by the load which due to lead inductance is probably less than 20A/us
In PCB design ground planes for supply with distributed SMT capacitors rountinely handle dI/dt's over 1000A/us, the GSM telephony board lying against the screen as I type this is testimony to that. Even a modern CPU drawing 100A or so with a 3GHz "square wave" clock
will need some serious bypassing,
