Eagle - how to eliminate solder mask ?

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soldering the wires is not a very good solution (10+ times the resistivity of copper, cannot reliably calculate current capacity or temperature rise of the copper, not safe) , using either the correct copper weight or track width is much better, or using bus bars.
 
True that regular leaded solder has higher resistivity than copper but you can still modify the solder mask, (tStop and bStop)... Then, if you want, you can add unleaded solder which has better conductivity than leaded solder.

Change layer to bStop or tStop and draw a polygon where you want solder mask to be opened up.

boB
 
The usual way to place Tin on Copper is by electroplating. The layer of Tin would be so thin as to be ineffectual in decreasing trace resistance. Tin has 6 times more resistance then Copper. A loosing proposition it seems.
 
True that regular leaded solder has higher resistivity than copper but you can still modify the solder mask, (tStop and bStop)... Then, if you want, you can add unleaded solder which has better conductivity than leaded solder.

Change layer to bStop or tStop and draw a polygon where you want solder mask to be opened up.

boB

bStop is bottom layer (blue wire) and tStop is top layer (red wire) ?
 
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