I need help to use Eagle.
I want to eliminate solder mask on some wires to add tin with the purpose of increase the thickness.
http://www.audiodesignguide.com/Ibridone/Ib2014_ph1.jpg
In this pcb I had to scrape some wires to eliminate the solder mask but this is not a professional result.
I want to eliminate solder mask on some wires to add tin with the purpose of increase the thickness.
http://www.audiodesignguide.com/Ibridone/Ib2014_ph1.jpg
In this pcb I had to scrape some wires to eliminate the solder mask but this is not a professional result.
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soldering the wires is not a very good solution (10+ times the resistivity of copper, cannot reliably calculate current capacity or temperature rise of the copper, not safe) , using either the correct copper weight or track width is much better, or using bus bars.
Yes, probably bus bar like these are better than large wire tinned.
ATLEE BUSBARS, COPPER BUSBAR AND POWER DISTRIBUTION PRODUCTS
The main problems are that there is no standard on these components and these are custom for big company so very difficult use these for DIY.
The alternative could be large copper wire jumps.
ATLEE BUSBARS, COPPER BUSBAR AND POWER DISTRIBUTION PRODUCTS
The main problems are that there is no standard on these components and these are custom for big company so very difficult use these for DIY.
The alternative could be large copper wire jumps.
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Some companies like Audio Research use tinned pcb wire.
http://www.drhifi.net.au/Reviews/ARC REF110 Review/Img0087.jpg
http://www.drhifi.net.au/Reviews/ARC REF110 Review/Img0087.jpg
True that regular leaded solder has higher resistivity than copper but you can still modify the solder mask, (tStop and bStop)... Then, if you want, you can add unleaded solder which has better conductivity than leaded solder.
Change layer to bStop or tStop and draw a polygon where you want solder mask to be opened up.
boB
Change layer to bStop or tStop and draw a polygon where you want solder mask to be opened up.
boB
The usual way to place Tin on Copper is by electroplating. The layer of Tin would be so thin as to be ineffectual in decreasing trace resistance. Tin has 6 times more resistance then Copper. A loosing proposition it seems.
True that regular leaded solder has higher resistivity than copper but you can still modify the solder mask, (tStop and bStop)... Then, if you want, you can add unleaded solder which has better conductivity than leaded solder.
Change layer to bStop or tStop and draw a polygon where you want solder mask to be opened up.
boB
bStop is bottom layer (blue wire) and tStop is top layer (red wire) ?
bStop is bottom layer (blue wire) and tStop is top layer (red wire) ?
Yes. When you remove the solder mask with polygons on tStop (top) and bStop (bottom), those areas will become covered with white lines, to indicate no solder mask.
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