I have concern that the MOSFETs to the ACA v1.8 may overhead my pcb due to the fact that I soldered them in a way that the MOSFET bodies and the board are touching each other, or will the heat sink dissipate sufficient heat? Should I have allowed for some airspace?
The critical thing is that the tab of the FET is cooled correctly and so if the heatsink is of sufficient size that requirement will be met. Fibreglass board will stand very high temperatures without issue, older paxolin and resin paper type much less so and they discolour easily.
As always... a picture might help 🙂
As always... a picture might help 🙂
