Class D, all chips are BGA?

Most fully integrated (modulator/driver/FETs) class-d IC's are in some form of surface mount package. Some of the Tripath IC's are through-hole, but not DIP.

The only DIP package IC I can even think of is the TPA3122D2.

There are parts available from IR that are DIP, but they all require external FETs and most need a modulator as well.


2010-09-16 1:02 pm
Sorry I meant non-surface mount not specifically DIP. Actually surface mount isnt the issue its surface mounts where you cant directly solder to the pins. How do you know if you soldered it right?

Do you guys use BGAs etc? I could use a hotplate if you say its easy.

Are the tripath ICs easy to use/good?


2010-10-29 11:24 pm
There is the option of the V-module VMA2015. It's a MAX9703 in a module package that has solder pads on the top of the base PCB with notches cut out that I believe could accept pins on a 0.1" pitch.

I may not have described that very well, so here's a link to the device datasheet with the physical footprint shown at the bottom.

The datasheet for the MAX9703 can be accessed HERE.

Short of buying through Deal Extreme, I have no idea where you can source them from though. The modules themselves are frequently out of stock, but DE sell an evaluation board carrying two of them preconfigured for stereo operation if that's any help.
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Actually surface mount isnt the issue its surface mounts where you cant directly solder to the pins.

Most BGA parts are low power (~2W), so I don't think you will find many people that bother to DIY with those anyway.

There is a good variety of mid-power QFP package IC's available. I've done quite a few boards with TQFP package using only a standard solder iron; it's really not that difficult.


Paid Member
2009-02-11 12:58 am
The LLP (National) or LFCSP (Analog Devices) packages are really not that hard to solder. It does take a bit of patience, though. First apply flux with a flux pen. Then tin the leads/pads of the IC and the board. Apply flux to the now tinned IC and board. Using a heat gun or hot plate, heat up the board until the solder melts and place the IC on top. The IC should snap into place due to the surface tension of the solder. Some people have good luck soldering the exposed pad on the bottom of those chips with a fat tip on a regular soldering iron.

For the leads, the trick is to apply flux then apply solder liberally. Wick up the excess with solder wick.

It's more involved than DIP, but leaded parts are out these days. Unfortunate for the DIY crowd.