I would be curious, and if the burn-in wish should have passed, I would see it as proof that the build up, the physical realization of a concept (circuit), has a significant influence on the sound;-)
I am, and I am in awe of anybody who can converse so well in a different language, my friend!
This is a very well known fact. If it were disputed here, it would be shocking.
Of course you must be joking.
This thread:
Nah... I think we're now beating the stain where the dead horse used to be.
Satisfy both sides: BURN'IN AMP FEST. 🙂
Tom
As an electrician, I don't know what you are talking about.
In much of the EU, you can take the plug from the wall, turn it 180, and plug it back in again. There is no keyway, and no convention as to which is live and neutral. Because the neutral is a live wire, and should be treated as such.
People don't turn the plugs around to see which sounds better. Though they might, if we plant the idea in their heads.
In some countries is one of the two conductors live and one not. You measure to earth. In these countries you can turn the plug 180 and listen comparatively.
A tip for an electrician;-)
A tip for an electrician;-)
Not a software engineer…. Predict curses will be exchanged, members will be banned, and this thread will be shut down.
Getting back to the lords work…. @peterpaan89 has the sound of your amp not improved? Have you tried troubleshooting ?
[OFF-TOPIC]
Thank you very much, I really appreciated your compliment. 😎
But really here is about writing and reading and without Google Translate I wouldn't be able to participate in the Forum.
I can't say a single word in English and I can't understand anything if someone speaks to me in English (or if I watch a video spoken in English).
And that's it.
P.S.: FWIW I'm a kind of a perfectionist and it takes me a while to post a comment because I can't get enough of Google Translate, but I also turn to Reverso and Google.com (and others) to look up what I really mean.
Then I re-read it and "correct" it before posting.
Just as an example, in Italian they say (literally translated): "You take your finger with your whole hand" and it took me a while to find the corresponding idiomatic phrase in English: "I gave you an inch and you took a mile.", but I like doing this way.
However, I often don't get the meaning of a sentence written in English especially if it's some kind of joke and I don't know what I'm supposed to understand.
Sometimes it may seem even pathetic, I realize that...
Anyway, thanks again, compliments are always welcome!
[/OFF-TOPIC]
The mistake is to assume that if we perform a peek measurement and the frequency response is linear from 0 to 100, then the thing would also sound real colored, reproducing all "tones" "equally loud". However, practice shows that an ideal concept breaks with physical reality. The only thing that can help here is a rebuild, eliminating all unnecessary transitions and materials. The little things add up: e.g. the solder tags on the cinch sockets. Solder the earth cable directly to the thread of the socket. With this example in mind, rework your devices - and be amazed afterwards;-)
It seems to me that we are riding a very lively horse here. It's just that the majority are not prepared, or willing, to ride along;-)
It is essentially about the distinction between concept and object (just as important to distinguish between observation and description and interpretation).
By the way: this is a prerequisite for "science", for "physics". And: the majority cannot distinguish between concept and object (and observation - description - interpretation). Some need decades, some can never)-;
It is essentially about the distinction between concept and object (just as important to distinguish between observation and description and interpretation).
By the way: this is a prerequisite for "science", for "physics". And: the majority cannot distinguish between concept and object (and observation - description - interpretation). Some need decades, some can never)-;
NDAs sometimes stop seasoned engineers on this forum who know what's going on from disclosing company technical data however here's what is going on
Abstract
Ultrasonic structural noise in semiconductors, especially in high-performance devices, can really mess with performance and even cause annoying sound issues. Luckily, dampers and heat spreaders can help by tackling both mechanical vibrations and heat management. This chapter breaks down how these components work together to cut down on ultrasonic noise, boosting the reliability and performance of high-quality semiconductors.
Introduction
Ultrasonic structural noise in semiconductors happens because of internal mechanical vibrations, often triggered by fast switching or other high-frequency activities. These vibrations can cause acoustic noise, hurting device performance and sometimes even making sounds that can be heard, which is a problem in sensitive applications. Handling this noise effectively is key to keeping high-quality semiconductors working smoothly and efficiently. That's where dampers and heat spreaders come in.
The Source of Ultrasonic Structural Noise
Mechanical Vibrations:
Semiconductor devices, especially those involved in high-frequency switching (like Class D amplifiers or digital power supplies), can create mechanical vibrations. This happens due to the piezoelectric effect—where certain materials get stressed when an electric field is applied—or from the rapid heating and cooling that happens during use.
Thermal Fluctuations:
When there's fast switching and high current flow, it causes localized heating in the semiconductor. The expansion and contraction that comes with this heating and cooling creates mechanical stress, which adds to the ultrasonic structural noise.
Role of Dampers in Minimizing Structural Noise
Dampers work by soaking up and getting rid of mechanical energy, which cuts down on vibrations in the semiconductor package. These materials, like elastomers, foams, or other flexible substances (think silicone or rubber), turn vibrational energy into heat, which reduces mechanical oscillations.
Dampers can be built into the semiconductor package or added on the outside to stop vibrations from turning into structural noise. This is super important in high-frequency applications where mechanical stress can be a big deal. By soaking up the vibrational energy, dampers can change or dampen the resonant frequencies in the package, lowering the chance of noise getting louder at the device's dominant pole frequency. For instance, putting damping materials around RF amplifiers or power devices helps stop resonant vibrations and the ultrasonic noise that comes with them.
Role of Heat Spreaders in Minimizing Structural Noise
Heat spreaders do a great job of spreading out heat across a semiconductor device, which helps reduce hotspots and thermal gradients. By keeping the temperature more even, heat spreaders cut down on the expansion and contraction that leads to mechanically induced noise. Materials with high thermal conductivity, like copper or graphite, are usually used for this job because they spread heat away from critical areas, reducing temperature differences across the device.
By keeping temperature changes in check, heat spreaders lower the risk of thermally induced vibrations and the structural noise that comes with them. For example, in power transistors or high-frequency ICs, heat spreaders help keep the temperature stable, which stops the mechanical vibrations and ultrasonic noise caused by thermal fluctuations. This combination of heat and vibration control makes semiconductors more reliable and last longer by cutting down on material fatigue and the risk of failure.
Combined Effect of Dampers and Heat Spreaders
Dampers and heat spreaders work together to handle ultrasonic structural noise in semiconductors. Dampers take care of mechanical vibrations directly, while heat spreaders stop vibrations from happening by managing the thermal environment. To get the most out of both, you need to carefully think about the materials and where to place them so they can absorb vibrations and spread heat as efficiently as possible. Advanced semiconductor packages often include both dampers and heat spreaders to offer extra protection against ultrasonic noise.
Conclusion
Dampers and heat spreaders are key players in cutting down ultrasonic structural noise in high-quality semiconductors. By tackling both the mechanical and thermal sides of how these devices work, they help boost the stability, performance, and reliability of semiconductors, especially in high-frequency and high-power situations. Understanding how vibration damping and thermal management work together is crucial for getting the best performance out of semiconductors and keeping unwanted noise at bay.
Abstract
Ultrasonic structural noise in semiconductors, especially in high-performance devices, can really mess with performance and even cause annoying sound issues. Luckily, dampers and heat spreaders can help by tackling both mechanical vibrations and heat management. This chapter breaks down how these components work together to cut down on ultrasonic noise, boosting the reliability and performance of high-quality semiconductors.
Introduction
Ultrasonic structural noise in semiconductors happens because of internal mechanical vibrations, often triggered by fast switching or other high-frequency activities. These vibrations can cause acoustic noise, hurting device performance and sometimes even making sounds that can be heard, which is a problem in sensitive applications. Handling this noise effectively is key to keeping high-quality semiconductors working smoothly and efficiently. That's where dampers and heat spreaders come in.
The Source of Ultrasonic Structural Noise
Mechanical Vibrations:
Semiconductor devices, especially those involved in high-frequency switching (like Class D amplifiers or digital power supplies), can create mechanical vibrations. This happens due to the piezoelectric effect—where certain materials get stressed when an electric field is applied—or from the rapid heating and cooling that happens during use.
Thermal Fluctuations:
When there's fast switching and high current flow, it causes localized heating in the semiconductor. The expansion and contraction that comes with this heating and cooling creates mechanical stress, which adds to the ultrasonic structural noise.
Role of Dampers in Minimizing Structural Noise
Dampers work by soaking up and getting rid of mechanical energy, which cuts down on vibrations in the semiconductor package. These materials, like elastomers, foams, or other flexible substances (think silicone or rubber), turn vibrational energy into heat, which reduces mechanical oscillations.
Dampers can be built into the semiconductor package or added on the outside to stop vibrations from turning into structural noise. This is super important in high-frequency applications where mechanical stress can be a big deal. By soaking up the vibrational energy, dampers can change or dampen the resonant frequencies in the package, lowering the chance of noise getting louder at the device's dominant pole frequency. For instance, putting damping materials around RF amplifiers or power devices helps stop resonant vibrations and the ultrasonic noise that comes with them.
Role of Heat Spreaders in Minimizing Structural Noise
Heat spreaders do a great job of spreading out heat across a semiconductor device, which helps reduce hotspots and thermal gradients. By keeping the temperature more even, heat spreaders cut down on the expansion and contraction that leads to mechanically induced noise. Materials with high thermal conductivity, like copper or graphite, are usually used for this job because they spread heat away from critical areas, reducing temperature differences across the device.
By keeping temperature changes in check, heat spreaders lower the risk of thermally induced vibrations and the structural noise that comes with them. For example, in power transistors or high-frequency ICs, heat spreaders help keep the temperature stable, which stops the mechanical vibrations and ultrasonic noise caused by thermal fluctuations. This combination of heat and vibration control makes semiconductors more reliable and last longer by cutting down on material fatigue and the risk of failure.
Combined Effect of Dampers and Heat Spreaders
Dampers and heat spreaders work together to handle ultrasonic structural noise in semiconductors. Dampers take care of mechanical vibrations directly, while heat spreaders stop vibrations from happening by managing the thermal environment. To get the most out of both, you need to carefully think about the materials and where to place them so they can absorb vibrations and spread heat as efficiently as possible. Advanced semiconductor packages often include both dampers and heat spreaders to offer extra protection against ultrasonic noise.
Conclusion
Dampers and heat spreaders are key players in cutting down ultrasonic structural noise in high-quality semiconductors. By tackling both the mechanical and thermal sides of how these devices work, they help boost the stability, performance, and reliability of semiconductors, especially in high-frequency and high-power situations. Understanding how vibration damping and thermal management work together is crucial for getting the best performance out of semiconductors and keeping unwanted noise at bay.
So, are you saying that simply redoing the solder connections will make a significant difference in the sound?