Hi,
Anyone know how resilient the leads are on the LM4702 ?
I wish to mount the device under the PCB (along with the power devices), sandwiched between the PCB and the heatsink. But this will mean bending the leads in the opposite direction from the supplied pre-bends, and I am hoping the leads won't snap off !!
TIA,
Chris.
Anyone know how resilient the leads are on the LM4702 ?
I wish to mount the device under the PCB (along with the power devices), sandwiched between the PCB and the heatsink. But this will mean bending the leads in the opposite direction from the supplied pre-bends, and I am hoping the leads won't snap off !!
TIA,
Chris.
Peter Daniel said:It is no problem. I do it all the time with LM3875 and it works fine.
Peter,
Excellent, thanks very much for that.
The amps will be mounted inside some active speakers, so I was concerned that unless they were mounted on the main external heatsink plate, they would get too hot.
Chris.
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