Yes, but ....
Remember you will now be dissipating 75W per device instead of 25W, and of course the entire bias current ~2.5A will be through the 1 device.
If we assume thermal R from FET junction to case as 1C/W, then we have to add 75C to whatever we end-up with as a heatsink temp. If this were say 60C, then the FET junction would be 135C !!!!
OK, this is within the thermal rating of an IRFP240 (150C), but it ain't gonna last for a really ong time
You naw start to understand why NP shares the load in his designs!
cheers, mark
Remember you will now be dissipating 75W per device instead of 25W, and of course the entire bias current ~2.5A will be through the 1 device.
If we assume thermal R from FET junction to case as 1C/W, then we have to add 75C to whatever we end-up with as a heatsink temp. If this were say 60C, then the FET junction would be 135C !!!!
OK, this is within the thermal rating of an IRFP240 (150C), but it ain't gonna last for a really ong time
You naw start to understand why NP shares the load in his designs!
cheers, mark
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