I have heard two schools of though on this:
One saying Do not mix them due to reliability issues.
The other saying it's OK as long as it'a high quality
Socket that forms an air tight seal to the IC Pins.
I recall years ago reliability issues when mixing Gold & Tin with
Computer memory so I'm inclined to believe it would be an issue.
Thoughts?
One saying Do not mix them due to reliability issues.
The other saying it's OK as long as it'a high quality
Socket that forms an air tight seal to the IC Pins.
I recall years ago reliability issues when mixing Gold & Tin with
Computer memory so I'm inclined to believe it would be an issue.
Thoughts?
Gold doesn't tarnish or corrode, silver/tin does.
What is wrong with soldering directly to the board I wonder.
What is wrong with soldering directly to the board I wonder.
Hello,
I have used gold plated sockets for my projects for decades now and have never had a problem with any of the leads. FWIW.
I have used gold plated sockets for my projects for decades now and have never had a problem with any of the leads. FWIW.
Apparently gold can dissolve in liquid tin, see Gold plating - Wikipedia section "Soldering issues", although I never noticed that when soldering gold plated contacts. I don't think it's applicable in your case anyway.
I've seen tin plating diffuse into copper over a few years, leaving a brick-red surface, so I guess this may be an issue with SnAu too. This paper suggests it too: Interdiffusion and phase formation at room temperature in evaporated gold-tin films - ScienceDirect
I guess systems are pretty reliable these days so why not.
I design usb scopes using a 4051 multiplexor and had a few duff ones.