I'm thinking about it too...
In other posts I red you have to multiply the thermal resistance for the power to dissipate (in Watt) to have the delta temperature ABOVE room temperature.
I think model 04/300 should be fine...
In other posts I red you have to multiply the thermal resistance for the power to dissipate (in Watt) to have the delta temperature ABOVE room temperature.
An externally hosted image should be here but it was not working when we last tested it.
I think model 04/300 should be fine...
F5 o.m. said:
"At 1.3 amps per channel, you will see idle heat dissipation of 62 watts. To keep the temperature rise of the heat sink to 20 deg C. above the ambient temperature, you will want a heat sink rated at about .6 deg C./watt for each transistor. An example of this would be a chunk of fi nned aluminum, with a series of 2” fi ns attached to an 8” by 6” base. You will need two per channel."
F1 o.m said:
"Place the amplifier in a well-ventilated location, as it draws 200 watts during operation and requires as much opportunity to cool itself as possible."
I'm doing something wrong but I can't understand what...
perhaps trying to build an amplifier?
F1 manual
"The voltage across R27 – R30 is approximately 0.60 volts DC, and this
figure sets the bias for the gain stages, which is slightly less than 2 amps
per side, 4 amps total."
I would definitely not go below a 4U size - and with slightly less than 2A bias per channel probably go for the 400mm. If depth is a concern then go for the 5U/300.
"The voltage across R27 – R30 is approximately 0.60 volts DC, and this
figure sets the bias for the gain stages, which is slightly less than 2 amps
per side, 4 amps total."
I would definitely not go below a 4U size - and with slightly less than 2A bias per channel probably go for the 400mm. If depth is a concern then go for the 5U/300.
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