Thanks for the reply. I did copper plating in the chemistry classes in the school, and in my house, but nothing serious. But now, I want to re-copper copper, say, to get an layer of electrolytic copper of lower resistance in a copper plate and tubing to make a coil shield. Shields, and non magnetic cores (for permeability tuning in my case), tend to lower the Q of the tuned associated circuits as the conductivity is poor. Then putting a layer of good copper over the copper shields lowers the resistance and increases Q.
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The surface of the copper plate donating species must be 2-3 times longer covered area. Plates place on all sides which should be covered with copper. Watch out for the coating color. If there is browning, lower amperage. Selection of the initial current determined by the current dissipation in elektorolite and metal. First, make a trial test. Better slow, but qualitatively.
OK, yes, I agree this concepts. I read somewhat that suggest to initially reverse the cell (Object piece in the anode) so initial corrosion make the future cathode to be cleaned inside the cell, and to use an anode filter coating to reduce liquid contamination from anode particles. Do you agree?
There may be several reasons. When the coating of complex shapes with texture are often defective. Perhaps in the electrolyte or electrolyte impurities were contained many copper sulfate. When the cover is not the copper surface (coated graphite), the current start almost from scratch. You can also add organic inhibitors for the coating uniformity. For example, gelatin, 0.1 - 0.2 g / l.
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