Stacking board level heatsinks

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Has anyone ever considered or used a pair of the typical "board level heatsinks" for TO-220 devices to decrease thermal resistance?

Have an application that I would like to add a little insurance. Not enough space to use something else.

Figure one should use the thermal compound between and some kind of way to mechanically attach them - an unused hole in the bottom one and one on the top with some kind of strap with more thermal compound.

Could this work or its there something I am missing? If I did not think the latter was likely true I wouldn't ask!

Put in the photo for clarity. Random photo - only has one hole.

Thanks for any comments.
 

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Then I would look for one of the long rectangular heatsinks that fits between the fins of the one in the photo, e.g. DIP style, but a bit bigger. Or, well, get a better °C/W heatsink. Strapping vertically just wouldn't be near the top of the list of options I'd consider.
 
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