I put some Silmic II on the dac chips in a Valab dac that runs 8 dac chips in parallel. The Silmic's are a little soft on the top and someone recommended bypassing them with a .1uF film cap. I don't have enough .1uF Wima's but I do have enough .01uF film caps by Vishay.
What would be the difference between using a .01 and .1 in this application?
What would be the difference between using a .01 and .1 in this application?
In the past I usually add a 0.1 surface mount ceramic directly on the print between the legs off any small electroylitics.
If you use caps "with legs" the inductance of these negate the very result you are looking for, namely a low impedance path at HF.
To make matters worse if there IS any HF component across the electroylitic then adding a 0.1 etc can make matters worse if it causes resonance with the internal self inductance of the cap. The answer as always is to back up all you do with careful measurements.
If you use caps "with legs" the inductance of these negate the very result you are looking for, namely a low impedance path at HF.
To make matters worse if there IS any HF component across the electroylitic then adding a 0.1 etc can make matters worse if it causes resonance with the internal self inductance of the cap. The answer as always is to back up all you do with careful measurements.
My opinion here is 10-100 nF and preferable 1206 or 0805 caps but I'll suspect that the product already has sufficient decoupling if it's a commercial product.
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