Hi,
I'm designing a PCB for a PCB mount toroidal transformer. However I could not find a good amount of articles on the internet which clearly states the safety standards involving mains circuit on a PCB.
I would use standard PCB mount IEC power inlet with fuse drawer and PCB mount transformer. I would like to insulate the solder joints on the bottom side of the board.
The component leads would be bent parallel to the solder pad before being soldered. I am looking for a practical method to insulate these pads.
I would appreciate any inputs.
Patrick
I'm designing a PCB for a PCB mount toroidal transformer. However I could not find a good amount of articles on the internet which clearly states the safety standards involving mains circuit on a PCB.
I would use standard PCB mount IEC power inlet with fuse drawer and PCB mount transformer. I would like to insulate the solder joints on the bottom side of the board.
The component leads would be bent parallel to the solder pad before being soldered. I am looking for a practical method to insulate these pads.
I would appreciate any inputs.
Patrick
commercial equipment does not rely on coatings or lacquers for good reasons.
Insulation is provided by air/creeping distance and solid insulation materials such as plastic sheets.
Open some equipment for reference please.
regards
Insulation is provided by air/creeping distance and solid insulation materials such as plastic sheets.
Open some equipment for reference please.
regards
The ones I know of:
- at least 10mm clearance between mains voltage and low voltage traces on the PCB.
- an insulating sheet between the underside of the PCB and the chassis, either fixed to the PCB or the chassis. This is probably only strictly necessary for a double insulated appliance though.
- at least 10mm clearance between mains voltage and low voltage traces on the PCB.
- an insulating sheet between the underside of the PCB and the chassis, either fixed to the PCB or the chassis. This is probably only strictly necessary for a double insulated appliance though.
I seem to remember a standard IEC 60950. There are various parts, but I think the ones that would be most helpful would parts 2 & 3.
I would insulate the chassis underneath the "mains" area with two layers of heavy duty adhesive tape.
I would place the "mains" area near an edge of the PCB.
I would ensure the trace layout meets the special requirements for creepage distance.
I would ensure that when the case is open, I cannot accidentally touch or drop any anything on the "mains" traces and/or soldered pads/joints.
I would place the "mains" area near an edge of the PCB.
I would ensure the trace layout meets the special requirements for creepage distance.
I would ensure that when the case is open, I cannot accidentally touch or drop any anything on the "mains" traces and/or soldered pads/joints.
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