Advice on layout modules in dissipante case

Hi,

As you can see in the picture attached I would mount 6 ucd 400 oem boards to 1 side, 2 boards to the other side with the smps3ka400. I read the smps can get quite hot so want to mount it to the side. It is a modushop dissipante 3u case so the sides are very nice heat sinks. They are in 2 parts however, every side has 2 20cm heat sinks. Bottom and top have ventilation holes, and are steel.

If I mount the smps to the bottom however I block the bottom airholes, and I doubt the steel will do anything for cooling. Would it be better to mount them 4 cm from the bottom plate using aluminium U profiles?

I'm also thinking of cutting a thick aluminium plate the size of the heatsinks, so I can mount the boards to this plate and next the plate to the sides. It would dissipate the heat a bit more over the heatsinks, or am I overdoing it?

I'm a bit dissapointed I can not have it more symmetrical, 4 boards per side or 8 boards on 1 side, but I can't make it work.

Thanks!
 

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