The last project I worked on at Intel was something similar, only they wanted to replace CPU chips in the field. Basically they ran heater traces under the chip, which would melt all the balls in the BGA, then you'd pull the chip off. Then put the new chip on and heat again, reflowing all 1200 odd connections just perfectly. Anyway at least I got my name on all the patents.
I proposed using the same trace that heated things as a temperature sensors, but apparently that idea wasnt good enough for to go for a patent, even though we got it to work. Interleaved measurements between PWM pulses and all. When I joined the project, they were weaving a separate sensor trace on top of the heater. My idea made a lot less work for the layout guy, less signals to be accommodated in a connector.
They retired us all, ultimately the facility where I worked for 20 years was razed to the ground and I never did hear what became of the project. I wrote the control software to follow a reflow temperature profile, for the particular solder paste used. It was a good job doing pure R&D with a small team of mostly RCGs. I dont even have to watch the video; seen it work already!
I proposed using the same trace that heated things as a temperature sensors, but apparently that idea wasnt good enough for to go for a patent, even though we got it to work. Interleaved measurements between PWM pulses and all. When I joined the project, they were weaving a separate sensor trace on top of the heater. My idea made a lot less work for the layout guy, less signals to be accommodated in a connector.
They retired us all, ultimately the facility where I worked for 20 years was razed to the ground and I never did hear what became of the project. I wrote the control software to follow a reflow temperature profile, for the particular solder paste used. It was a good job doing pure R&D with a small team of mostly RCGs. I dont even have to watch the video; seen it work already!
