TPA3116 grounding

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U130421

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Joined 2015
The datasheet preconizes to ground the IC via the thermal pad . The pad is on the upper side where the heat sink sits upon either with silicon paste or glue . How to link electrically the pad to the heat sink ? 2x7 amp can pass through .
Sorry I posted wrongly on this forum instead of classD can it be moved , if you please.
 
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