Are you guys using thermal paste or anything for these. There's nothing in the build directions
stating anything on it.
Heat sinks should be used with a thermal interface, such as a thin layer of thermal paste
under the right compression force. Otherwise, the thermal resistance of the sink to device case
increases, causing the junction temperature of the device to increase.
+1 for the thermal goop. It actually makes a big difference. I use Wakefield 120 thermal grease. The "126" model would work as well. The difference is that the "126" is more tolerant to solvents used for PCB cleaning.
A less messy option is to use one of the silicone pads, such as Bergquist SilPad. They're pretty inexpensive and easy to work with.
Tom
A less messy option is to use one of the silicone pads, such as Bergquist SilPad. They're pretty inexpensive and easy to work with.
Tom
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