Advangages of using new IRF240 in TO-204 package?

[PSz.]

Brian,

The answer is likely linked to the thermal resistance between junction and case.

regards,
PSz.

 

[awpagan]

So, does the steel cap act like a heat capacitor? Gotta be a reason it has a poorer thermal rating...

Brien, could very well be
steel doesn't dissipate as well.

how about putting some heatsinks on top of the TO3's as well.

just to see what happens

ps anyone!! remember the top case is active


pps
PSz you edited
How about the internal die and case?



allan

 

[PSz.]

Allan,
I had originally posted "die and case" then edited to "junction and case" as I think it is the technically correct way of expressing the same idea.

regards,
PSz.

 

[awpagan]

Allan,
I had originally posted "die and case" then edited to "junction and case" as I think it is the technically correct way of expressing the same idea.

regards,
PSz.

PSz
Yes thats what i saw, then while i was replying it changed.

I was refer to the internal die of the component.
e.g fake transistors using smaller die's but same package.

allan