It is FAR worse with the stuff they acquired from Sanyo. 99% of it was gone in a year or two.Many Fairchild power transistors have been on the axe since onsemi bought them out.
The maximum junction temperature is driven by a local hot spot and not the overall size and average temperature.
Must be very clever die design to have lesser hot spot in a smaller die with the same function / specification.
Patrick
One could easily have a 200 C maximum hot spot in two different dies of different dimensions. Just making it go from say 5x5 mm to 7x7 does not guarantee a lower peak temp at the hottest spot. Lower average temperature across the entire die for sure. But reliability is driven by the hottest spot.
Getting shunted over to new lines as legacy equipment is retired? Could be uniformity across wafer too.Must be very clever die design to have lesser hot spot in a smaller die with the same function / specification.
Patrick