Hey all,
This is my first post here, so hi all! My first question is to do with Power MOSFETS again... I know this may have been answered before, but I can't find it in the search engine! Basically, my question relates to the difference between the 2SK1058 and the BUZ900DP... Since the BUZ900DP is a double-die version of the 2SK1058, would it be okay to replace two parallel 2SK1058's with one BUZ900DP (and two parallel 2SJ162's with one BUZ905DP)?
The only major difference I see is that the power handling of the BUZ devices is only 250W, compared to 300W of the combined 2SK1058/2SJ162 pairs.
If the consensus seems to be that the BUZ devices can easily replace two of the 2SK/2SJ devices, I was going to try it in Randy's Opti-MOS design. I assume that to be "safe", I should only run the system at 200WRMS into 4ohm?
Any comments appreciated!
Thanks!
Shash.
This is my first post here, so hi all! My first question is to do with Power MOSFETS again... I know this may have been answered before, but I can't find it in the search engine! Basically, my question relates to the difference between the 2SK1058 and the BUZ900DP... Since the BUZ900DP is a double-die version of the 2SK1058, would it be okay to replace two parallel 2SK1058's with one BUZ900DP (and two parallel 2SJ162's with one BUZ905DP)?
The only major difference I see is that the power handling of the BUZ devices is only 250W, compared to 300W of the combined 2SK1058/2SJ162 pairs.
If the consensus seems to be that the BUZ devices can easily replace two of the 2SK/2SJ devices, I was going to try it in Randy's Opti-MOS design. I assume that to be "safe", I should only run the system at 200WRMS into 4ohm?
Any comments appreciated!
Thanks!
Shash.
You can do it fine and you have recognised the power differences as well.
I prefer to use separate device though because it's easier to make thick tracks from the devices than monster tracks. Also, the surface area to the heatsink is a little more with separate devices. This is one of the reasons why power handling is a little lower.
I prefer to use separate device though because it's easier to make thick tracks from the devices than monster tracks. Also, the surface area to the heatsink is a little more with separate devices. This is one of the reasons why power handling is a little lower.
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