Thread an enamel wire under the entire IC body. Tie one end off an use the other to apply pressure to one of the outermost legs as you heat it with your iron. You will pull the wire out under the leg as the solder melts, freeing that leg. Repeat down the row until an entire side is free, then do the other side of the chip.
The only thing to watch out for is pulling too hard and applying pressure in the wrong direction. As long as you are careful the legs won't be too bent. (Don't overheat the chip, but that isn't usu. a problem.)
The only thing to watch out for is pulling too hard and applying pressure in the wrong direction. As long as you are careful the legs won't be too bent. (Don't overheat the chip, but that isn't usu. a problem.)
You could try making a cheap DIY hot air gun and use it to desolder...
http://www.usbmicro.com/odn/index.html
Click on Hot-Air Pencil on the left hand side menu.
James
http://www.usbmicro.com/odn/index.html
Click on Hot-Air Pencil on the left hand side menu.
James
For packages smaller than SOIC it is probably the only alternative to a hot air rework station.- Status
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