true, however don't want to unecessary parallel more BJT to complicate structure even more.
The beauty of this is its simplicity.
Do you think that 250mW is too much for a SOT23?
this one looks good too but I can see a SMT part for it
http://www.fairchildsemi.com/ds/SS/SS9014.pdf
http://www.fairchildsemi.com/ds/SS/SS9014.pdf
should we go TO92? but that would be too much for it too, wouldn't it?
Yes cooling for OP AMPS seem to be a viable option too.
thanks for posting this ap note.
Here is a quote from it, which is basically all we need in this case
"The most cost effective approach of designing layout 2 0.066 square inches copper pad directly under the package, without occupying additional board space, can increase the maximum power from approximately 1.1 to 1.3W."
I am surprise that doubling the pad top and bottom doesn't yeald to better results!!!
yeah that's what I mean. It's unclear on the document where vias are, it almost look like they had bottom pad with no vias, but that wouldn't make any sense, so I am assuming the test had proper vias.
Either way if I can achieve 1.1W with only top pad I can use bottom for routing and I don't need more than 0.5W dissipation anyway and the 50% margin is what I uausally try to aim on my designs for reliability (wherever and whenever it's possible)
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