If you were to layout a 4 layer circuit
board (using CAD software)
for a high powered amplifier
design, what would be a good layer stackup?
Method #1
Layer 1 = signal
Layer 2 = split plane, + rail and gnd
Layer 3 = split plane, - rail and gnd
Layer 4 = signal
Method #2
Layer 1 = signal
Layer 2 = split plane, + rail and - rail
Layer 3 = ground
Layer 4 = signal
Method #3
Layer 1 = signal
Layer 2 = signal
Layer 3 = ground
Layer 4 = split plane, +rail, -rail
Method #4
Layer 1 = signal
Layer 2 = ground plane
Layer 3 = + rail plane
Layer 4 = -rail rail plane
** only 1 signal layer - yikes.
Method #5
Layer 1 = signal
Layer 2 = + rail plane
Layer 3 = ground plane
Layer 4 = -rail rail plane
** only 1 signal layer - yikes.
etc.
board (using CAD software)
for a high powered amplifier
design, what would be a good layer stackup?
Method #1
Layer 1 = signal
Layer 2 = split plane, + rail and gnd
Layer 3 = split plane, - rail and gnd
Layer 4 = signal
Method #2
Layer 1 = signal
Layer 2 = split plane, + rail and - rail
Layer 3 = ground
Layer 4 = signal
Method #3
Layer 1 = signal
Layer 2 = signal
Layer 3 = ground
Layer 4 = split plane, +rail, -rail
Method #4
Layer 1 = signal
Layer 2 = ground plane
Layer 3 = + rail plane
Layer 4 = -rail rail plane
** only 1 signal layer - yikes.
Method #5
Layer 1 = signal
Layer 2 = + rail plane
Layer 3 = ground plane
Layer 4 = -rail rail plane
** only 1 signal layer - yikes.
etc.