Recently posted concerning bias, junction temp and longevity of the mosfet output devices.
Checking the 4-40 bolts that hold my IRF devices to the heatsink, I found they indeed needed just a slight twist to snug up again....not too tight though. Wondering if they were loose enough that any damage was done to the mosfets, because of not transferring enough heat.
Frankly, they were just a smidge looser, not much at all, but it got me to wondering about how these devices fail. The only ones I've read about failing
on F-5 have been from miswires, usually switching the wrong device in the wrong place on the board.
Do these devices tend to either "work" or "not work" when they fail, or is it a gradual breakdown with worse and worse sound quality or what?
Thanks to any that know,
Russellc
Checking the 4-40 bolts that hold my IRF devices to the heatsink, I found they indeed needed just a slight twist to snug up again....not too tight though. Wondering if they were loose enough that any damage was done to the mosfets, because of not transferring enough heat.
Frankly, they were just a smidge looser, not much at all, but it got me to wondering about how these devices fail. The only ones I've read about failing
on F-5 have been from miswires, usually switching the wrong device in the wrong place on the board.
Do these devices tend to either "work" or "not work" when they fail, or is it a gradual breakdown with worse and worse sound quality or what?
Thanks to any that know,
Russellc