Are you saying the traces on PCB's are tin lead solder or what I dont quite understand this!
As to PCB's and valves, they are used in guitar amps quite a lot, take up the stress of being thrown around.
Heat, like ALL hot components you ensure they are not tight to the board, sockets that stand off.
Removing Valves, again like any component that may cause mechanical stress, use some form of mechanical fixing.
There are always ways to engineer a solution, and where you can score with PCB's is where you have to control RF immunity.
End of day both done correctly will work either done bad will be rubbish.
Early PCB's used with valve designs were CEM, a crappy paper based material great for cheep single sided designs (hundreds of 70s TVs), again materials have developed, you might have heard of lead free
, well the increase in processing temperatures this requires means that your PCB materials have to also handle hotter temps, plus there are different grades and temp ranges of FR4 that will do the job without having to resort to silly esoteric dialectric. Also look at what they are doing with LED lighting and PCB's...This has been an anouncment by the Printed Circuit Board Defence League, have fun
On a more esoteric side, when I get chance I want to do a PCB for my valve monoblocks, but have the track layers machined out of 2mm copper with a clear plastic or air dielectric (its a 2 layer design), played about with 4 and 6oz copper PCB's as well, now they are good, and you can also remove the heat from hot spots with the correct design.
Usually mass made equips use low price solder(solder without silver), but to reduce costs they can use just sole lead (plumblum or Pb);
yet another reason why pcb is a mystery bag, how thick is it? did the manufacturer use the right glue? will it stand the test of time? should I leave the trace clean or should I lay down half a spool of expensive silver solder?
Will cockroaches come into the amp and lay their eggs inbetween the active and neutral terminals and make a horrible smell when I turn it on again. True story *pop*
With ptp it just goes straight to where it needs to go, no detours or roundabouts, no worry about cracking or material types.
Will cockroaches come into the amp and lay their eggs inbetween the active and neutral terminals and make a horrible smell when I turn it on again. True story *pop*
With ptp it just goes straight to where it needs to go, no detours or roundabouts, no worry about cracking or material types.
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pcb board
So if a pcb is to be made what would be the recommended copper thickness and board material type.
I am just about to rebuild a set of amps built to the hybrid design Jeff Macaulay published in the Sept 1995 issue of Eletronics world. I have 2 young children so I wanted to make it as safe as possible and the pcb route seemed to fit this.
A lot of the components are fitted to a pcb anyway and I wired the rest but wanted it all fitted to the board to simplify it.
I made the original pcb's but as I have a small machine shop in my garage the thought of milling the pcb really appeals to me. Time rich and money poor you see!
So if a pcb is to be made what would be the recommended copper thickness and board material type.
I am just about to rebuild a set of amps built to the hybrid design Jeff Macaulay published in the Sept 1995 issue of Eletronics world. I have 2 young children so I wanted to make it as safe as possible and the pcb route seemed to fit this.
A lot of the components are fitted to a pcb anyway and I wired the rest but wanted it all fitted to the board to simplify it.
I made the original pcb's but as I have a small machine shop in my garage the thought of milling the pcb really appeals to me. Time rich and money poor you see!
I always thought good soldering (small volcano shaped joint of solder) in through the hole boards would stand up to most anything -- heat to cold. Look at the old running way too hot to fry an egg mobile phones installed in cars before. Massive traces, lots of heats pushed out and measured in watts, and no point to point wiring.
If you do want to go all artistic, then point to point is great looking (the CMoy amp that was encased in clear plastic a little while ago).
Done right, both work, but you just have to know how much to engineer and how much to overbuild it. And it also depends how long you want to spend behind the soldering iron as through the hole is probably quicker to place and solder without much more thinking than looking at the instructions or schematic, noticing polarity, and how much wire goes through the hole.
If you do want to go all artistic, then point to point is great looking (the CMoy amp that was encased in clear plastic a little while ago).
Done right, both work, but you just have to know how much to engineer and how much to overbuild it. And it also depends how long you want to spend behind the soldering iron as through the hole is probably quicker to place and solder without much more thinking than looking at the instructions or schematic, noticing polarity, and how much wire goes through the hole.
PCB with copper tracks is very rare, cause the copper is difficult to melt.
I see it just once in a web image, the tracks had the usual red colour.
I dont know what is worse to audio raw copper or cheap solder.
I avoid buy tube amps with PCBs, cause the PCBs usually are big and prevent the proper cooling of the amp.
The fresh air dont pass through the amp, since the PCB blocks the flow of air.
not according to wikipedia: Printed circuit board - Wikipedia, the free encyclopedia
Thats a significant magnitude thinner.
If you mean the copper trace thickness that is.
LOL,
sorry but you guys are a bit way off with PCBs and the materials...
PCB traces are copper.
You cannot solder with lead on its own. Generaly these days a SAC based solder will be used, for commercial its lead free, or tin lead eutectic if you are exept from RoHS. Silver solder to non silver solder no difference unless you are soldering silver wire.
Copper starts at 9um and can go up to 245um; 35um is 1oz. For your amps 1 to 2oz should be sufficient.
All commercial boards are made, designed, fabricated and qualified by IPC specifications, there are spacs to cover anything and everything you'll ever want to know about PCB's, so dont scare yourselves with old wives tales, think of all the PCB's in the world today...
And as I have said there are specs that cover all aspects of PCB's , heres a list of a few, the sections that cover material quality are the 41xx numbers.
So as you can see this PCB stuff is pretty serious wot ho
1601: Printed Board Handling and Storage Guidelines
2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards
2152: Standard for Determining Current Carrying Capacity in Printed Board Design
2221A: Generic Standard on Printed Board Design
2222A: Sectional Design Standard for Rigid Organic Printed Boards
2223B: Sectional Design Standard for Flexible Printed Boards
2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
2226: Sectional Design Standard for High Density Interconnect (HDI) Boards
2251: Design Guide for the Packaging of High Speed Electronic Circuits
2252: Design Guide for RF/Microwave Circuit Boards
2316: Design Guide for Embedded Passive Device Printed Boards
2611: Generic Requirements for Electronic Product Documentation
2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
2614: Sectional Requirements for Board Fabrication Documentation
2615: Printed Board Dimensions and Tolerances
3406: Guidelines for Electrically Conductive Surface Mount Adhesives
3408: General Requirements for Anisotropically Conductive Adhesives Films
4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards (English)
4103: Specification for Base Materials for High Speed/High Frequency Applications
4104: Specification for High Density Interconnect (HDI) and Microvia Materials
4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar
4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry
4203: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and F
4204: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
4553A: Specification for Immersion Silver Plating for Printed Boards
4554: Specification for Immersion Tin Plating for Printed Circuit Boards
4562A: Metal Foil for Printed Board Applications
4563: Resin Coated Copper Foil for Printed Boards Guideline
4761: Design Guide for Protection of Printed Board Via Structures
4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend
4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed
4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe
5701: Users Guide for Cleanliness of Unpopulated Printed Boards
5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards
5704: Cleanliness Requirements for Unpopulated Printed Boards
6011: Generic Performance Specification for Printed Boards
6012C: Qualification and Performance Specification for Rigid Printed Boards
6013B: Qualification and Performance Specification for Flexible Printed Boards
6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De
6018A: Microwave End Product Board Inspection and Test
7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
7095B: Design and Assembly Process Implementation for BGAs
7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard
7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD
9201A: Surface Insulation Resistance Handbook
9252A: Requirements for Electrical Testing of Unpopulated Printed Boards
9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te
9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering
A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards
A-600H: Acceptability of Printed Boards
A-610E: Acceptability of Electronic Assemblies
A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies
AC-62A: Aqueous Post Solder Cleaning Handbook
C-406: Design & Application Guidelines for Surface Mount Connectors
CA-821: General Requirements for Thermally Conductive Adhesives
CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl
CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards
CH-65A: Guidelines for Cleaning of Printed Boards & Assemblies
CM-770E: Component Mounting Guidelines for Printed Boards
D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
D-325A: Documentation Requirements for Printed Boards
D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse
D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
DR-572A: Drilling Guidelines for Printed Boards
HDBK-005: Guide to Solder Paste Assessment
HDBK-830: Guidelines for Design, Selection and Application of Conformal Coatings
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Incl
J-STD-003B: Solderability Tests for Printed Boards
J-STD-004B: Requirements for Soldering Fluxes
J-STD-005: Requirements for Soldering Pastes - includes Amendment 1
J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
J-STD-012: Implementation of Flip Chip & Chip Scale Technology
J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
J-STD-026: Semiconductor Design Standard for Flip Chip Applications
J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Mi
J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
MC-790: Guidelines for Multichip Module Technology Utilization
ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print
MS-810: Guidelines for High Volume Microsection
QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
S-816: SMT Process Guideline & Checklist
SA-61A: Post Solder Semi-Aqueous Cleaning Handbook
SC-60A: Post Solder Solvent Cleaning Handbook
SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards
SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
SM-784: Guidelines for Chip-on-Board Technology Implementation
SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
SM-817: General Requirements for Dielectric Surface Mounting Adhesives
SM-839: Pre & Post Solder Mask Application Cleaning Guidelines
SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat
T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress
TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
TR-583: An In-Depth Look At Ionic Cleanliness Testing
WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin
WP-008: Setting Up Ion Chromatography Capability
sorry but you guys are a bit way off with PCBs and the materials...
PCB traces are copper.
You cannot solder with lead on its own. Generaly these days a SAC based solder will be used, for commercial its lead free, or tin lead eutectic if you are exept from RoHS. Silver solder to non silver solder no difference unless you are soldering silver wire.
Copper starts at 9um and can go up to 245um; 35um is 1oz. For your amps 1 to 2oz should be sufficient.
All commercial boards are made, designed, fabricated and qualified by IPC specifications, there are spacs to cover anything and everything you'll ever want to know about PCB's, so dont scare yourselves with old wives tales, think of all the PCB's in the world today...
And as I have said there are specs that cover all aspects of PCB's , heres a list of a few, the sections that cover material quality are the 41xx numbers.
So as you can see this PCB stuff is pretty serious wot ho
1601: Printed Board Handling and Storage Guidelines
2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards
2152: Standard for Determining Current Carrying Capacity in Printed Board Design
2221A: Generic Standard on Printed Board Design
2222A: Sectional Design Standard for Rigid Organic Printed Boards
2223B: Sectional Design Standard for Flexible Printed Boards
2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
2226: Sectional Design Standard for High Density Interconnect (HDI) Boards
2251: Design Guide for the Packaging of High Speed Electronic Circuits
2252: Design Guide for RF/Microwave Circuit Boards
2316: Design Guide for Embedded Passive Device Printed Boards
2611: Generic Requirements for Electronic Product Documentation
2612: Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descript
2612-1: Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
2614: Sectional Requirements for Board Fabrication Documentation
2615: Printed Board Dimensions and Tolerances
3406: Guidelines for Electrically Conductive Surface Mount Adhesives
3408: General Requirements for Anisotropically Conductive Adhesives Films
4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards (English)
4103: Specification for Base Materials for High Speed/High Frequency Applications
4104: Specification for High Density Interconnect (HDI) and Microvia Materials
4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boar
4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
4202A: Flexible Base Dielectrics for Use in Flexible Printed Circuitry
4203: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and F
4204: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
4552: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
4553A: Specification for Immersion Silver Plating for Printed Boards
4554: Specification for Immersion Tin Plating for Printed Circuit Boards
4562A: Metal Foil for Printed Board Applications
4563: Resin Coated Copper Foil for Printed Boards Guideline
4761: Design Guide for Protection of Printed Board Via Structures
4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend
4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed
4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printe
5701: Users Guide for Cleanliness of Unpopulated Printed Boards
5702: Guidelines for OEMs in Determining Accept Levels of Cleanliness of Unpopulated Printed Boards
5704: Cleanliness Requirements for Unpopulated Printed Boards
6011: Generic Performance Specification for Printed Boards
6012C: Qualification and Performance Specification for Rigid Printed Boards
6013B: Qualification and Performance Specification for Flexible Printed Boards
6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive De
6018A: Microwave End Product Board Inspection and Test
7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
7095B: Design and Assembly Process Implementation for BGAs
7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard
7526: Stencil and Misprinted Board Cleaning Handbook - FREE DOWNLOAD
9201A: Surface Insulation Resistance Handbook
9252A: Requirements for Electrical Testing of Unpopulated Printed Boards
9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Te
9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects
9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
9704: IPC/JEDEC Printed Wiring Board Strain Gage Test Guideline
9708: Test Methods for Characterization of Printed Board Assembly Pad Cratering
A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards
A-600H: Acceptability of Printed Boards
A-610E: Acceptability of Electronic Assemblies
A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies
AC-62A: Aqueous Post Solder Cleaning Handbook
C-406: Design & Application Guidelines for Surface Mount Connectors
CA-821: General Requirements for Thermally Conductive Adhesives
CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembl
CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards
CH-65A: Guidelines for Cleaning of Printed Boards & Assemblies
CM-770E: Component Mounting Guidelines for Printed Boards
D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
D-325A: Documentation Requirements for Printed Boards
D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Asse
D-422: Design Guide for Press Fit Rigid Printed Board Back Planes
DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
DR-572A: Drilling Guidelines for Printed Boards
HDBK-005: Guide to Solder Paste Assessment
HDBK-830: Guidelines for Design, Selection and Application of Conformal Coatings
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Incl
J-STD-003B: Solderability Tests for Printed Boards
J-STD-004B: Requirements for Soldering Fluxes
J-STD-005: Requirements for Soldering Pastes - includes Amendment 1
J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
J-STD-012: Implementation of Flip Chip & Chip Scale Technology
J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf
J-STD-026: Semiconductor Design Standard for Flip Chip Applications
J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps
J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other Mi
J-STD-033B: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
MC-790: Guidelines for Multichip Module Technology Utilization
ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer print
MS-810: Guidelines for High Volume Microsection
QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
S-816: SMT Process Guideline & Checklist
SA-61A: Post Solder Semi-Aqueous Cleaning Handbook
SC-60A: Post Solder Solvent Cleaning Handbook
SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards
SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting
SM-784: Guidelines for Chip-on-Board Technology Implementation
SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
SM-817: General Requirements for Dielectric Surface Mounting Adhesives
SM-839: Pre & Post Solder Mask Application Cleaning Guidelines
SM-840E: Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Mat
T-50H: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology
TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress
TR-579: Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
TR-583: An In-Depth Look At Ionic Cleanliness Testing
WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Prin
WP-008: Setting Up Ion Chromatography Capability
As stated PCB traces are copper and of a purity to apease the most offworld audiophile...
Further more why put solder on top of your PCB trace it dosn't achieve anything, and the resistance of solder is way worse than the copper, so pick a copper wieght thats right for the job, heres a link to a calculator that will help you deciede what copper thickness you require and what trace width...
Saturn PCB Design - PCB Via Current | PCB Trace Width | Differential Pair Calculator | PCB Impedance
Further more why put solder on top of your PCB trace it dosn't achieve anything, and the resistance of solder is way worse than the copper, so pick a copper wieght thats right for the job, heres a link to a calculator that will help you deciede what copper thickness you require and what trace width...
Saturn PCB Design - PCB Via Current | PCB Trace Width | Differential Pair Calculator | PCB Impedance
Raw copper had alot of oxigen that built oxidation when is apply electric current.
For this is used OFC in audio, which is a little better.
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