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Old 9th January 2004, 08:10 PM   #1
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Default TO3 direct heatsink

With so many new heatsing for the PC parts including RAM chips via conductive epoxy, I wonder:
Why does no-one ever glue heatsinks directly to the can on a TO3?
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Old 9th January 2004, 08:31 PM   #2
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I suspect that glues cannot hold the device / heatsink together very tight so the thermal resistance with glue is higher than that with screws / bolts.

to3 devices tend to be higher powered devices so a little bit increase in thermal resistance can mean big increases in temp.
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Old 9th January 2004, 08:31 PM   #3
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A similar idea is posted here:
GREAT new heatsink idea!
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Old 9th January 2004, 08:41 PM   #4
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Those are a little bigger than I meant but right idea. Also I meant gluing them to the plain metal back of the device as well as the existing bolt on plate.
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Old 9th January 2004, 08:49 PM   #5
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There are many possibilities, as long as you just keep the two center pins free from electrical connection to the heatsink....
It's "just" cooling!!! Meaning that if you had a waterteight connection on the two center pins, you could through the whole TO3 device in a bucket of water

The matter that counts is how much heat you can atticipate from the TO3 device with your heatsink or cooling system.

I belive that you will be able to use both CPU and RAM cooling blocks for the TO3 device with good result... However some tests must be done... I'm thinking of using a CPU cooler for a ultra compact 40W Power Amplifier But I haven't tested it yet
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Old 9th January 2004, 09:47 PM   #6
maylar is offline maylar  United States
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Replacing the transistor would be a cramp if it was epoxied to the heatsink...

drc
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Old 9th January 2004, 10:46 PM   #7
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Absolutely
You have just provided the answer to your own question
But the idea is interesting
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Old 9th January 2004, 11:42 PM   #8
sam9 is offline sam9  United States
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Ive build a no-cost heatsink for TO-220s and TO-218s bt sandwitching them between some CPU heatsinks. Ugly as hell but it worked.

On the otherhand if the the TO-3s are MK15003 or similar you would need something the size of a paperback book glued to the can! Sounds a tad manky.
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Old 10th January 2004, 08:55 AM   #9
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As well as. Not: instead of. Yes of course I realise that you can't replace the designed solution, and there is no reason to.

The back is an area of the device which is not being cooled. Just seems a shame not to take advantage.
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Old 10th January 2004, 10:07 AM   #10
Tensop is offline Tensop  Lebanon
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well from memory the die on a to3 is directly against the base, meaning through the bottom would be the best heat path
you could just use some of the arctic silver thermal paste that overclockers use on their cpus... it seems to keep their CPUs down about 2-6 degrees under 80watt loads with active cooling

Oh and the clamping pressure on the device itselt matters.. you will get a tighter press, and due to the not so strong material in which the base of these transistors are made of it will mate with the material of the heatsink, forming an even flatter surface
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