Please critique my board...
I am completely for filling in any unused copper areas, but isn't the separation between some tracks a bit too thin?
How about RF attenuator on the input?
330pF to 1n5F is a suitable range for most builders.
Now added...
I am completely for filling in any unused copper areas, but isn't the separation between some tracks a bit too thin?
Yes this has now been changed.
Does the NFB go directly to the Signal Ground/Return?
Is this Signal Ground separated from all the other Grounds/References on the PCB?
The LME has it's own ground including power and signal. There is then another main GND so the output and power devices.
A seperate GND for signal and LME power can be easily obtained.
Separate the Signal Return from the local Power Ground of the lme chip. And connect the NFB directly to the Signal Return. Do not connect these chip INPUTS to the Power Ground.
So the signal GNDs are seperate from the LME power GND? What about the GND pin on the LME? Do the two GNDs need to be linked?
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