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#1 |
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diyAudio Member
Join Date: Oct 2003
Location: Denmark, Viborg
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Ive been thinking a lot about how to give the components of a SOZ the lowest possible running temperature.
Ive machined a round cabinet of aluminium (20mm wall thickness 180mm high 450mm diameter) and mounted the heatsinks on the outer diameter all the way around (around 35kg of heatsinks, all machined to fit). The point of this is to be able to run all components at the same temperature by simply mounting them closer or further from the center of the box at the bottom side (exept the mosfets that will be mounted on the upper side alone to make sure they are plenty cooled). I thought of the option to mount the components on a block of copper and then mount the copper on the aluminium, to take advantage of the excellent heat transfer properties of copper at the relatively small surface i have between the component and the copper...and then make the copper block lets say 4 times the footprint of the component and mount it in the box.... anybody knows if the loss of heat transfer between the respective surfaces is too big to make this work?? Magura
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Everything is possible....to do the impossible just takes a little while longer. www.class-a-labs.com |
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#2 |
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The one and only
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If you're a machinist, then you already know how to
make a really flat surface and put it under pressure against another. A little thermal grease won't hurt, either.
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#3 |
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diyAudio Member
Join Date: Oct 2003
Location: Denmark, Viborg
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What i really wanted to know was if it pays off...is it a good idea.
The making of such is no big deal. Im a toolmaker in diecasting and have acces to any machine i could ask for. Magura
__________________
Everything is possible....to do the impossible just takes a little while longer. www.class-a-labs.com |
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#4 |
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The one and only
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The SOZ was specifically designed to appeal to guys who
aren't afraid of big hardware but are a little shy about circuit complexity. Interestingly this appears to comprise a large segment of the DIY community. So big hardware for SOZ is highly recommended. |
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#5 |
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diyAudio Member
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Plus it's cool to see so few parts doing so much!
I remember reading that you can run the high power resistors a lot closer to their ratings without having to worry about it, as opposed to the FETs. |
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#6 | |
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diyAudio Member
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A couple of comments.
1. I am very jealous of your machining tool access. 2. Using copper as a heat spreader plate works very well. I have done this in the past while designing a 400MHz to 860MHz Class A push pull amp using a LDMOS device that had two mosfets in the same package. Bias dissapation was around 10 watts and the package just wasn't big enough to get the heat out of in our space requirements without going to a 1/4" thick copper spreader plate first. A later version of the design did go straight to aluminum, but I had forced air cooling working for me there. Use thermal compound (sometimes called heatsink grease) and make sure both devices are as flat as possible. Scott Quote:
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#7 |
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The one and only
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Zalman makes some killer copper mushroom shaped finned
assemblies. You'll see them in ZV6, if that's what it ends up being called.
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#8 | |
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diyAudio Member
Join Date: Oct 2003
Location: Denmark, Viborg
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Quote:
what ratio did you have between the size of footprint (resistor-copper> copper-aluminium) ? Magura
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Everything is possible....to do the impossible just takes a little while longer. www.class-a-labs.com |
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#9 | |
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diyAudio Member
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Quote:
Scott |
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#10 |
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diyAudio Member
Join Date: Oct 2003
Location: Denmark, Viborg
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Its meant mainly for the resistors of a SOZ...they dissipate 250W
Magura
__________________
Everything is possible....to do the impossible just takes a little while longer. www.class-a-labs.com |
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