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Old 5th January 2007, 05:54 PM   #1
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Default looking for heatsink pillows

Back in the day, I read about a fluid filled bag that can be placed over hot components, under a package lid..the purpose of it was to transfer heat from the comps to the lid, where the heat could be removed.

Anybody know what the name was? I've googled for a while, and found a patent for it, but no manufacturer's name.

Cheers and thanks

John
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Old 6th January 2007, 08:42 AM   #2
Tom2 is offline Tom2  United States
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jneutron,

Try this link, look almost half through the page.
3M, with fluorinert in them. Click on the picture of them.

http://www.edn.com/archives/1994/012094/02DFcov.htm

I sorta remember hearing about them. I have never used them.
I don't know if they are still manufactured.

Tom
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Old 6th January 2007, 02:32 PM   #3
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Thanks Tom.

At lunch the other day, we were actually talking about immersing the entire supply system into a coupla hundred gallons of flourinert, but because the system is bound for Geneva, I believe we have a sensitive environmental problem with a swimming pool full of the stuff.

The link didn't work for me on the computer I'm using today, so I'll have to contact 3M monday to follow up on your tip.

Thank you for your time.

Cheers, John
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Old 6th January 2007, 09:06 PM   #4
Tom2 is offline Tom2  United States
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jneutron,

It was just a short mention of them in an article on microprocessor
cooling in 1994.

Here is the picture of them in the article.

Glad I could help.

Tom
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Old 6th January 2007, 11:39 PM   #5
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Quote:
Originally posted by jneutron
At lunch the other day, we were actually talking about immersing the entire supply system into a coupla hundred gallons of flourinert, but because the system is bound for Geneva, I believe we have a sensitive environmental problem with a swimming pool full of the stuff.
Don't you mean Davos? I heard that Al Gore (Earth in the Lurch) will be at the WEF.
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